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Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
- Pickering Interfaces Inc.
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PCI Resistor Card 2-Channel 1.5 Ohm To 8.19k Ohm
50-293-024
The 50-293 is a Programmable Resistor card with either two channels of 16-bit or four channels of 8-bit resistor chains in a single PCI card. The card is ideal for simulating sensors for control and management systems under test, allowing the user to verify system response in design verification or manufacturing test applications.
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Probe Card Test & Analysis
Automated probe card test and repair is used to monitor probe card health to ensure cards are ready and capable of testing semiconductor devices. In cases where the card is not meeting performance specification, repairs may be performed such as tip adjustment or card cleaning, thus returning the card quickly to a production state.
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Connectors
Through our Hypertac, IDI and Sabritec technology brands, we supply application-specific, high-reliability electrical interconnect solutions from highly integrated assemblies to microminiature connectors and spring probe contacts. The core of our advanced interconnect solutions is our contact technologies: Hyperboloid, Tortac, Spring Probe, High Speed, Edge Card, Fiber Optic, EMI/EMP, High Power and High Temperature.
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Cryogenic Applications
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe card as well as DUT probing solutions. These custom cryogenic probe card solutions are widely used to test Space, Military, Medical and Quantum Computing products. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovative custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cableout designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Probe Cards
Ceramic Blades
SV TCL offers a variety of ceramic blades and blade probe cards. We have patented ceramic microstrip blade probes available in low leakage and low capacitance for optimal signal transference, while SV TCL's blade cards are ideal for parametric and RF testing.
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Complete Power Analysis System
PK3564-PRO
PK3564-PRO complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, Mini Line-to-DC Converter, Bluetooth Adapter, USB Communications Cable, and 1-year deluxe warranty.
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Probe Cards
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.
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Probe Card
VersaTile™
Celadon has reduced the size of a probe card to 28mm with the VersaTile™ with Advanced Cantilever™ technology. The VersaTile™ with Advanced Cantilever™ technology can fit on a conventional 3-hole mount probe positioner for single site probing. The same VersaTile™ with Advanced Cantilever™ technology can be used in a 300mm VersaPlate™ for multi-site probing.
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Semiconductor Test
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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CMOS Image Sensor
CIS
CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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Probe Cards
LCD Driver
LCD Driver devices are utilized in some of the most popular high definition tech products such as LCD televisions, high functioning smart phones and tablets.
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Mid Bus Probes
MBP850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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Probe Card
Indexer™
The patented Indexer™ is the industry’s first automatic probe card changer designed for lights out parametric test.*Can support up to five VC20™’s with Advanced Cantilever™ technology, any variety*Card changes are complete in seconds*Fully programmable*Tested for hundreds of thousands of touchdowns.
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Vertical Probe Cards
B3
The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
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PCIe 2.0 Test Platform
PXP-100B
The Teledyne LeCroy PXP-100B Test Platform provides a convenient means for testing PCIe 2.0 add-in cards with a self-contained portable and powered passive backplane. The PXP-100B provides power required for both cards under test, and an interposer can be used for connection to a protocol analyzer. As an alternative to an interposer, the PXP-100B includes two mid-bus probe footprints to allow connection to an analyzer via a mid-bus probe.
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Fiber Inspection Probe
FIP-920
FIP-920 Fiber Optic Inspection Probe combines a 3.5” high definition TFT LCD display, provides a detailed image of fiber end-face, zoom in/out feature make it easy to identify the smallest particles, scratches. With the attached SD card memory, you can capture/record the live end-face image, the image file can be reviewed/transferred via SD card reader or USB cable. Up to 8hrs battery working make it possible to inspect the fiber end-face at any time and any place.
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DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Probe Card
T40™ Series
Ultra low noise and fast settling modeling and characterization tests are made possible by Celadon’s patented ceramic probe cards.
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Osprey Probe Card
The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design. The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.
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ECHO 7 Ultrasonic Precision Thickness Gage
ECHO 7
ECHO 7 represents our most advanced thickness gage ever. ECHO 7 offers a 3.5” high resolution sunlight readable color display with live A-Scan, use of a wide variety of contact, delay line and immersion probes from 1-20 Mhz as default and custom created and stored applications setups, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 7 is available in 4 models including the ECHO 7, ECHO 7DL, ECHO 7W and ECHO 7DLW.
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PCI Express Card Slot Interposer
PCIE850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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PCI Express® 5.0 Interposer
OCP NIC 3.0
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
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PCIe 4.0 Protocol Analyzer
Summit T48
Teledyne LeCroy’s Summit™ T48 joins the Summit™ T416 as the second protocol analyzer to be released in its family of tools supporting the PCIe 4.0 architecture. The new Summit™ T48 protocol analyzer based on the PCIe 4.0 specification supports up to 16GT/s and up to x8 lane width for protocol analysis. Companies that are interested in testing PCIe 4.0 based I/O cards such as Storage Controllers, Ethernet, Fibre Channel, Infiniband, and others will now be able to get all of the protocol analyzer debugging features they need, while being able to better manage their costs. SSD storage applications will also benefit from the integrated support for SSD bus protocols such as PCIe/ NVMe/ SMBus/ NVMe-MI/ TCG and others. When combined with Teledyne LeCroy’s Summit™ Z416 protocol exerciser, the Summit™ T48 will provide a deeper understanding of test results on a variety of test configurations. Teledyne LeCroy’s wide range of high speed interposers and probes provide full flexibility and connectivity to CEM and other form factor sockets on system boards as well as solder down and mid-bus probes.
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Probe Holders
Model P7
Made from 300 series stainless steel, the P7 probe holders accept all model 407 replaceable probe tips, and are secured with a set screw. When used with the P7 Tool Holder Adapter Arm; “Z” position adjustments are easy, and can accommodate a variety fixtures and probe card holders. Designed for both high temperature (-65 to 300°C) and high electrical isolation measurements.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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AUTOMATED TEST STAND DESIGN
Automated test systems may be as simple as a laptop with a DAQ module or a stand-alone controller, but they typically require a mix of off-the-shelf and custom hardware. All that hardware is integrated and wired into a test stand. Portable or mobile test stands are ideal for in-the-field research and development and servicing of multiple laboratories or manufacturing lines. Test stand access to the front panels of hardware and subcomponents allows manual configuration of non-automated settings. Quick disconnects, cable harnesses, and easy access to probes provides efficient setup and tear-down. Expandable or modular rack mount and card base systems facilitate future needs. Ergonomic considerations include keyboard and display placement, along with number of monintors. Safety is always crucial with proper E-stop placement and keeping dangerous elements away from users.
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Cantilever Probe Cards
Venture
Nidec SV Probe’s VentureTM line of cantilever probe cards represents the finest epoxy technology on the market and are perfect for logic testing. The Venture line includes an extensive array of cantilever cards, single to multi-die for a variety of test systems. Other capabilities include: • 3K Points • Pad Pitches as Tight as 35µm • Up to 32 DUTsContact your Nidec SV Probe sales representative to determine which VentureTM product is right for your testing application.
