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- Virginia Panel Corporation
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TriPaddle Signal, Module, ITA, 256 Position
510108131
TriPaddle Signal, Module, ITA, 256 Position
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Mixed Signal Test Systems
MTS1000i
The MTS-1000i is lowest cost platform available in the MTS series of ATE. It has a reduced platform size compared to the MTS-2010i & MTS-1020i, reduced power supplies, and 4 slots. It is mainly intended for single site testing. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process
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Mixed Signal Test Systems
MTS2010i
The MTS-2010i are a cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.
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Engineering Support Platform
ESP
ESP, or Engineering Support Platform, is a low cost, powerful and versatile platform for the development, deployment and support of FPGA Applications. ESP is powered by DSX core, ARC’s core element for the development and deployment of digital and mixed signal systems. The standard system contains 2 custom FPGA system, often configured in combination where one acts as the application firmware, and the other is used for test. But the system is expandable and configurable in any combination to solve any problem in a digital, analog or mixed signal system. The FPGAs can be configured to generate, analyze, process and/or output complex signals at a wide range of voltages, frequencies and serial protocols. It has been used to develop solutions for Radar systems, testers, Pattern Generation, digital signal processing and generating, Video processing, and many more. ESP comes as a desktop or rack mounted solution, and no special interfaces are needed.
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MEMS Device-Oriented Testers
Are your test requirements oriented to defined families of devices, with common characteristics? You do not need to purchase an expensive, general-purpose mixed signal tester: You can rely on SPEA DOT 100, a system designed to answer the test requirements of MEMS and other low-pin-count devices at an incredibly low cost.The DOT 100 is based on a revolutionary per-device architecture: each device under test has a dedicated CPU managing the entire test process, while each card hosts all the resources for the parallel test of 3 devices, in the size of a postcard.
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Build to Print
In today’s fast paced manufacturing environment, where time to market and cost competitiveness is key, having a manufacturing partner like ARC can be a valuable resource for your company. ARC has a build-to-print manufacturing capability with our unique ‘engineer-to-print’ philosophy to make sure precision manufacturing and final build accuracy is top priority for your module level or system level builds. ARC can support up to several hundred module level assemblies (CCA subassemblies, cabling, mechanical and paneling elements) with abilities to perform a variety of software, embedded tasks and functional testing including a mixed signal test capability using our in-house MSAT (Mixed Signal Automated Tester) platform. We have a thorough process created through the development of our own products and test solutions. We know the importance of having a regimented manufacturing process, augmented with engineering expertise to address challenges that come up with building complex, high-mix, medium volume products.
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Production Test System
G3 Hybrid
The G3 Hybrid is a state of the art system for fast Production test throughput in DC test applications. The system combines the most versatile offerings of features in a single system, at the lowest cost. For devices requiring DC and Continuity test capability only, G3H is a very flexible cost-effective Production Test solution. This approach provides a DC test system with the capability to add logic resources (AC/SCAN) as well as analog resources for Mixed Signal. The HILEVEL G3H embraces low cost while supporting SCAN, giving you the ability to toggle every node in your chip.
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Mixed Signal Test Systems
MTS1010i
The MTS-1010i is a more economical version of the MTS-2010i & MTS-1020i testers. It has a reduced platform size and reduced power supplies. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.
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A Popular Combination Of Flex 10 And Flex 20 In A Compact Footprint
Flex 30 ATE
A combination of both the Flex 10 and 20 system, the Flex 30 is floor mounted system that maintains a small footprint whilst offering that useful additional space. Generally it is fitted with either the G12 or G12X VPC interface allowing a large number of mixed signal connections to be routed to the test fixture.
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Wafer Probe Test System
STI3000
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Mixed signal LSI test system
Multi-pin type model is now launched in WL27 Logic/Power mixed LSI test system.This system is suitable for multi-site test in A/D mixed device such as automotive・motor driver IC. It’s a high throughput and cost performance mixed signal LSI test system.
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Mixed Signal Battery Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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Software
Digilent’s proprietary software solutions enable you to communicate with our system boards and a wide assortment of logic devices and use our available analog and digital test & measurement instruments. Refined by customer feedback for years, these powerful and FREE software applications allow you to fully customize your project, from creating and modifying designs for your system board to custom scripting of instruments for capturing, recording, analyzing, and generating mixed signal and mixed domain waveforms.
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SoC Test System
V93000 SoC / Smart Scale
Advantest’s V93000 Smart Scale generation incorporates innovative per-pin testing capabilities. Each pin runs it own sequencer program for maximum flexibility and performance, for example in multisite applications. Full test processor control ensures time synchronization between all card types, like digital, Power, RF, mixed signal and so on. The user benefits are reduced test time, best repeatability and simplified program creation. The system design makes it easy to extend your configuration with new modules and instrumentation, as your test needs change.
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GoldenGate RFIC Simulation Software
GoldenGate RFIC Simulation and Analysis Software is an advanced simulation and analysis solution for integrated mixed signal RFIC designs that is fully integrated into the Cadence Analog Design Environment (ADE). GoldenGate is part of Keysight's RFIC simulation, analysis and verification solution that also includes Momentum for 3-D planar electromagnetic simulation, SystemVue & Ptolemy wireless test benches for system-level verification, and the Advanced Design System (ADS) Data Display for advanced data analysis. This suite links the RF system, subsystem, and component-level design and analysis as part of a unique and comprehensive RFIC design flow.
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Mixed Signal Test Systems
MTS1020i
The MTS-1020i is a cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process
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Regenerative Battery Pack Test System
17040
Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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ESD Test System
58154 Series
ESD (Electrostatic Discharge) Test Systems are PXI/PCI controlled module to simulate electrostatic discharge pulse during electronic device testing. The 58154 series offer both ESD STM5.1-2001-Human Body Model and ESD STM5.2-1999-Machine Model. The user friendly software offers programmable and flexible features, such as sampling test on a wafer, ESD model, ESD pulse polarity, ESD pulse interval in a sequence, and automatic testing function.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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OLED Lifetime Test System
58131
The 58131 Lifetime Test System is designed specifically for the OLED industry. Model 58131 provides twoquadrant constant current (CC) and constant voltage (CV) stimulus to each OLED panel and acquires electrical and optical characteristics automatically. Two independent and isolated precision source-and-measure units (PMU) are incorporated in one modular card, which is capable of testing two OLED panels. Additional instrument cards are added to expand test capacity. Hot plug and play is a key feature of 58131. When a UUT fails or an instrument card needs to be replaced, 58131 does not have to be shutdown and testing continues for other UUTs. Hot plug and play obviates life test cycle restarts due to isolated faults and significantly improves life test efficiency. We firmly believe that hot plug and play capability should be mandatory for all lifetime test systems.
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VLSI Test Systems
50/100 MHz clock rate50/100 Mbps data rate1024 I/O pins (Max :1280 I/O pins)Up to 1024 sites Parallel testing32/64 M pattern memoryVarious VI sourceFlexible HW-architecture (Interchangeable I/O, VI, ADDA,)Real parallel trim/match functionTime & frequency measurement unit (TFMU)High-speed time measurement unit (HSTMU)AD/DA test optionSCAN test option (max 1G M/chain)ALPG test option for embedded memorySTDF tools supportTest program/pattern converter(J750, D10, V50, E320, SC312, V7, TRI-6020, ITS9K)User friendly windows 7 environmentCRAFT C/C++ programming languageSW (Software) same as 3380P & 3360P
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Test System Replication/Build-to-Print
Need to manufacture test stations? For more than 15 years we have sourced, assembled, tested and shipped fleets of robust, cost-effective solutions. We produce them at our high-volume facilities and deploy them around the world.
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Communications Test System for Frontline Diagnostics
ATS3000P
The ATS3000P is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000P also includes the sophisticated IF and baseband I/Q DigitalSignal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easyto-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets are available for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Advanced SoC/Analog Test System
3650
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Automatic Test System
Automatic Test system is the ultimate solution for power electronic testing. The system includes a wide range of hardware choice such as AC/DC Sources, Electronic Loads, DMM, Oscillate Scope, Noise Analyzer and Short /OVP Tester. This flexibility combined with its open architecture software platform-PowerPro III, gives users a flexible, powerful and cost effective test system for almost all types of power supply testing.
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Test System
BMS HIL
The BMS Hardware-in-the-Loop (HIL) Test System is a high performance platform providing all necessary input signals used for battery pack simulation. A real-time operating system executes complex cell and pack models commonly used for BMS algorithm development and firmware regression testing.
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PXI Semiconductor/IC Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Iridium Physical Layer Test Systems
PLTS
Averna has worked with Iridium to ensure you have the right equipment to support their test coverage. The Iridium PLTS verifies product performance to Iridium’s standards. Find out more!
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Battery Management (BMS) Environmental Test System
The BMS Environmental Test System is a configurable platform simulating the essential signals used by Battery Management Systems (BMS) and cell-monitoring modules with the ability to perform environmental testing on multiple BMS units simultaneously. The system implements single-point value testing to evaluate specific BMS functions such as cell over and under voltage scenarios, cell leakage current, lost communications, or faulty system IO.
