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IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
- TEAM SOLUTIONS, INC.
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DC-to-60MHz 1:10 Oscilloscope Probe Kit (HP-9060 Or HP-3060)
PRB-HP-9060
Up to 60MHz, Includes a handy storage pouch and includes an IC test-hook adapter for the probe., The BNC connector rotates to avoid cable tangle or kink., Cable length is 1.4 meters.
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Light-to-Analog Sensors (Voltage)
Renesas' light-to-voltage silicon optical sensors combine a photodiode array, a non-linear current amplifier and a micropower op amp on a single monolithic IC. Applications for these devices include display backlight control, keypad dimming, anti-glare mirror systems, and industrial and medical light sensing applications.
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Kelvin IC Clip Lead
16089C
Measure odd-shaped components that you cannot measure using conventional fixtures
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Wireless Data Logger
EVA100
The new highly integrated measurement system "EVA100" is supporting Power Supplies, SMU( 4 quadrant DC Signal Measurement Units ), Pattern Generators, Arbitrary Waveform Generators, Digitizers and Oscilloscopes necessary for complete analog / mixed-signal / sensor / digital IC devices and Modules including Electronic Control Unit (ECU) for automotive evaluation and measurement.This new measurement system allows engineers quickly to build their own measurement environment without combining several standalone instruments.
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LVDT Sensor Amplifiers
Analog Devices signal conditioning ICs, together with linear variable differential transformers (LVDTs), can be used to convert mechanical position to a dc voltage. The IC provides both the excitation for the LVDT and the output conversion to dc level with a user selectable gain. ADI LVDT signal conditioners are available to interface with a wide range of LVDTs, including half bridge and standard 4- and 5-wire.
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IC-3120, 1.91 GHz Intel Atom Quad-Core Processor, 2-GigE Port Industrial Controller
784959-01
The IC‑3120 is a compact and rugged industrial controller that withstands the harsh environments common in automation, supervisory control, distributed control, and industrial embedded OEM applications. The IC‑3120 offers two Gigabit Ethernet ports with Power over Ethernet (PoE) technology, FPGA-based I/O capabilities, and network connectivity for distributed control applications. The advanced features include the ability to synchronize image inspection results with industrial I/O and configure hardware-timed network triggers to trigger camera acquisition, motion control, or data acquisition. You can use the advanced FPGA personality that is shipped with the system or customize the FPGA functionality using the LabVIEW FPGA Module.
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LOAD BOARD
The semiconductor manufacturing process is divided into a front process (WAFER) and a post process (PACKAGE). The LOAD BOARD is an INTERFACE device for inspecting the function and performance of a package state IC, which is a post process, It is an INTERFACE key device for inspection. In particular, LOAD BOARD is widely used in non-memory semiconductor inspection equipment.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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600A Digital Clamp Meter
7128C
Peaceful Thriving Enterprise Co Ltd
This is an auto-ranging, high accuracy and stable hand held clamp meter to make electrical maintenance safe and easy. With special designed IC to support true RMS, the meter is available to measure AC/DC voltage to 600V, AC/DC current to 600A and resistance to 60MΩ; also having the capability to test diode, continuity, frequency and non contact voltage sensing. Sub switch included Function Select, Value Hold, Range Select, Relative Value Measurement, Inrush Current Indication, Hz/Duty Cycle, Illumination and Back-light.
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Light-to-Analog Sensors (Current)
Renesas' light-to-current silicon optical sensors combine a photodiode array and current amplifiers on a single monolithic IC. These devices are ideal for display and keypad dimming, as well as industrial and medical light sensing applications.
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784970-01
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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IC EMC Analysis
We carry out standard measurements according to BISS/IEC and analysis of the interference immunity and interference emissions of ICs during development.With the targeted EMC analysis, we uncover weak points in the ICs so that the IC developer can use them to develop improvements for the product
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Custom ASIC Design
Need a solid IC solution for your business that is developed fast and right first-time? We address your IC development challenge and leverage our decades-long expertise in custom IC design and development to your benefit.
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ICs For Wireless Charging System
The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Decap and delayer-chemical decap
Materials Analysis Technology Inc.
Decapsulation uses a chemical solution to remove IC packages in order to expose dies for further analysis
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Analog Switch/Multiplexers
Our analog switch IC portfolio ranges from SPDT switches to larger octal SPDT or quad DPDT switches. It features low on-resistances, integrated 15 kV protection diodes and negative charge pump, and with a bandwidth meeting audio or USB requirements.
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Ion Chromatography
930 Compact IC Flex
The 930 Compact IC Flex is a versatile ion chromatograph developed with a focus on the requirements of routine users.
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FMC L-Band RF Receiver
Sundance Multiprocessor Technology Ltd.
The Creonic L-band RF receiver FMC card allows to receive RF signals between 925 and 2,250 MHz. It is ideally suited for satellite communication with standard satellite dishes since it includes a DiSEqC driver IC for LNB controlling. The board allows to build receivers with symbol rates of up to 100 Msymbols/s. Due to the low-pin-count (LPC) FMC connector it can be used with any FMC carrier board that supports VADJ=1.8V. The card will be available from Q2/2017.
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900 MHz Trunk Hybrid Amplifier
AS 1515
Hybrid Amplifiers used in Trunk and branch lines specially designed to serve the needs of cable systems with very Long Trunk Cables. They are in Aluminium Housing providing maximum heat dissipation and have RFI Shielding. They incorporate superior quality Hybrid IC Module to obtain excellent features.- Frequency Range: 40 ~ 1000 MHz- Mains cum Power Pass- Output Level: 102 dBµV- Level Flatness: ±0.75 dB- 32 dB Gain (40 dB Optional)- Optimum for- Trunk Distribution- Superior Quality- Hybrid IC Module- Hybrid IC Protected- Voltage Selection LED - for Easy Selection
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NFC-V Sensor Tag Smart Labels & Data Logger IC
AS39513
The AS39513 is an NFC sensor tag and data logger IC for smart labels which enables more efficient and accurate monitoring of the condition of assets such as food, pharmaceuticals and healthcare products in storage and in transit.
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K-type Thermocouple to Digital Converter
THERMO K click
THERMO K click carries the MCP9600 IC from Microchip. Depending on the type of probe it uses the click can measure temperatures from −200 °C to +1372 °C.
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IC Test Probes
C.C.P. Contact Probes Co., LTD.
Our IC Test Probes are suitable for pitches of less than 0.012mm.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Mixed-Signal Design
Teledyne DALSA’s mixed-signal group, formerly known as Axiom IC, delivers high-performance, high-quality data-converter designs and IP blocks for the industrial, professional, scientific, imaging and audio markets. Based in the Kennispark business and science park in Enschede, The Netherlands, the group works in close cooperation with the University of Twente and supports PhD students and trainees to stay involved in the newest CMOS design methodologies and technologies.
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Steering Diodes
ProTek's low capacitance Steering Diode Arrays provide high-speed data line and I/O port protection from transients caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), Tertiary Lightning and other induced voltages. Steering diodes divert the transient to the power-bus or ground and away from sensitive IC components.
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Scatterometer with Thin Film Measurement Capabilities
OptiPrime-X Series
The n&k OptiPrime-X series are automated metrology systems used to fully characterize and monitor Thin Film and OCD applications for both current and next generation IC processes.
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Dip Clip, 16 Pin With Nickel Silver Contacts
3916A
Dip Clip, 16 pin with Nickel Silver contacts. Pomona DIP Clip® test clips are designed for testing dual-in-line IC packages on PC boards. These devices incorporate many built-in features that assure a positive electrical connection as well as hands free testing.
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Multi-Output Driver ICs
Housing multiple half-bridges and high-side switches on a single IC, our multi-output driver ICs are designed to drive small automotive loads and medium current DC motors as well as providing protected supply lines.
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Pressure Sensors
ESCP-SAPT Transmitter
ESCP-SAPT pressure transmitters consist of a MEMS capacitive pressure sensor die, which is underpinned by ES’ innovative microfabrication process that has been proven suitable for the mechanical, radiation and temperature environment of space applications. The full custom, radiation-hardened signal conditioning IC was designed entirely by ES, utilizing a standard deep submicron CMOS process of a European foundry.
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Probe Cards
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.