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- TEAM SOLUTIONS, INC.
product
8 SE Or 4 Diff. Input Channels, 8 Analog Output Channels, PCI Express
APCIE-3121-8-8
Input range:?± 10 V, 0-10 V software programmable0-5 V, ± 5 V, 0-2 V, ± 2 V, 0-1 V, ± 1 V (gain)0-20 mA (option) ? software-programmable amplifier:PGA x1, x2, x5, x10 ? Conversion triggered through software,scan, timer, external event ? Onboard FIFO buffering for 256 analog values ? Data exchange through 16-bit I/Oor 32-bit memory (PCI DMA) ? Sequence RAM ? Overvoltage protection ? input filter: 160 kHz
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Multipurpose Debug Board
DB40 Debug Module
The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features: - Port 80/81 decoding for Power On Self Test (POST) via LPC - Interface to SPI Flash for BIOS update - Interface to Board Management Controller (BMC) for update - Power and Reset buttons and status LEDs The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this purpose. (Includes DB40 Debug Module, two 40-pin FFC cables, and 14-pin cable for SP100 DediProg USB to SPI programmer.)
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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COM Express Type 10 Starter Kit Plus
COM Express Type 10 Starter Kit Plus
The COM Express Type 10 nanoX Starter Kit Plus consists of a COM Express Type 10 core module reference carrier board that provides two PCIe Mini Card slots, 2 RJ-45 LAN ports, 2x USB 3.0, 2x USB 2.0, 1x USB client, 2x DB-9 COM, 1x SD card socket, and Mic/Linein/ Line-out. ADLINK also provides additional development tools including a verified 10.1" LVDS panel (optional), power supply, thermal solution and cabling accessories.
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COM Express Type 7 10GBASE-T Network Adapter Card
CEI-4x10GBASE-T
- Support up to four 10GbE copper interfaces (10GBASE-T)- COM.0 R3.1 Type 7 compliant- Dedicated for Express-ID7
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4-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor (up To 3.3 GHz), Intel® Q87 Chipset, And Front-access I/O And PCIe/PCI Slots
IPC934-230-FL
To provide excellent computing capability, the high performance IPC934-230-FL industrial PC is equipped with the newest 4th generation Intel® Core™ i7/i5/i3 or Celeron® processor in 22nm process and Intel® Q87 Express chipset. Total four PCI/PCIe expansion slots allow installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications. The rugged Intel® Hasewell fanless industrial computer is an ideal fit for automatic optical inspection, digital signage appliance, POS/kiosk, embedded controller, factory automation and many more applications.The 4-slot industrial PC is guaranteed to operate reliable in temperature ranging from -10°C to +50°C and is equipped with a 10~30 VDC 150W wide range power supply for mission-critical environments. It supports an easy-to-install fan module to dissipate heat generated within the system when high power consumption PCI/PCIe cards are installed. The all-in-one industrial embedded computer provides rich I/O connectors include two 2.5” SATA HDD, one CFast™ socket, four COM ports (one RS-232/422/485, three RS-232), two USB 3.0 ports, four USB 2.0 ports, dual Gigabit Ethernet, PS/2 ports, one DIO, audio and DVI-I. Moreover, the IPC934-230-FL supports various power protection including OVP (Over voltage protection), OTP (over temperature protection), OPP (over power protection) and SCP (over circuit protection) for more system safety.
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COM Express Type 10 Development Baseboard
CEB94017
*COM Express Type 10 baseboard*2 SATA-300 and SD card slot*1 PCI Express Mini Card slot*5 USB 2.0 and 2 USB 3.0*Port 80 display for debugging
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COM Express Type 10
The COM Express Type 10 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Computer On Module
ITX-M-CC452-T10
The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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COM Express Type 10 Reference Carrier Board
miniBASE-10R
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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COM Express Type 7 Basic Module With Intel® Xeon® D-1500 & Pentium® Processor D1500
CEM700
The CEM700 offers scalable processor options from the 16-core Intel® Xeon® D-1577 processor to the 4-core Intel® Pentium® D1519 processor (codename: Broadwell DE). This COM Express Type 7 module comes with two 10GBASE-KR channels and supports two DDR4-2400 SO-DIMM slots for up to 32GB system memory. It delivers powerful server-class performance in a small form factor of 125 x 95 mm. Axiomtek's CEM700 is well-suited for integration into compute-intensive and space-constrained applications in need of high data and network throughputs, such as edge computing, microserver, data transmission device, and other networking fields. The Axiomtek's CEM700 incorporates two 10GBASE-KR interfaces and an NC-SI (Network Controller Sideband Interface) for remote management to fulfill server application demands. The Intel® Broadwell DE-based module has a wide operating temperature range from -20ºC to +70ºC (or optionally -40ºC to +85ºC) to fully serve the needs of diverse applications. To enable fast turnkey evaluation, Axiomtek also provides CEB94701, the COM Express type 7 baseboard to operate with CEM700. Customers can quickly emulate the functionality for software development and hardware verification.
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Qseven
Qseven module is a very small size Computer-on-Module targeting towards low power and mobile applications. The Qseven footprint is smaller than that of COM Express and ETX. The maximum power consumption is no more than 12 watt.
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Computer-On-Module
ETX®
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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Full-Size PCI Express Mini Module With COM
AX92906
*USB to 2 Channel high speed RS-232 ports*Supports one half-size PCI Express Mini card slot (PCIe only)
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COM Express Type 6 Application Board With MXM Slot
CEB94022
*MXM type A supported*SATA-600*LVDS, VGA, HDMI, and DisplayPort*4 USB 2.0 and 2 USB 3.0*2 PCI Express Mini Card slots*3 RS-232/422/485 and 1 RS-232
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COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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COM Express Type 6 Compact Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM313
The CEM313, a COM Express® Type 6 compact module, is built with the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the COM Express® type 6 module prevails in its excellent graphics performance while supporting DX12.0, OCL 2.0, OGL 4.3 with resolution up to 4K (3840 x 2160 @ 30 Hz). Furthermore, two 204-pin SO-DIMM DDR3L-1600 have been deployed in the CEM313 up to a maximum of 8 GB Overall. With the innovative design of low power consumption, wide temperature range, and seismic resistance, the CEM313 can be served as an excellent solution for graphics-intensive applications over the IIoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Computer-on-Modules
Arm-based Computer-on-Module with OSM, SMARC, Qseven, rugged RTX, and COM Express Type 7 as well as embedded board design services.
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COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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COM Express Type 6 Development Baseboard
CEB94011
*COM Express type 6 baseboard for evaluation purpose*USB 3.0 supported*Port 80 display for debugging*Smart battery supported
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Computer On Modules
COM Express Basic
COM Express Basic is the latest COM 125mm x 95mm form-factor, including Intel core i, Intel 6th Generation and Intel Atom processor. Because of wide range of processors, Intel core i, Intel 6th Generation and Intel Atom processors, COM Express can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI, and IDE for legacy applications.
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COM Express Type 6
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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COM Express Type 10
The COM Express Type 10 Mini (84 x 55 mm, credit card size) module is intended for low power platforms (TDP 12W and below), capable of entry level processing with ultra-low power consumption, while supporting graphics and optimized I/O count for mobile applications. Type 10 modules are targeted at handheld devices (smart battery) for industrial, medical, transportation, and controllers for outdoor applications.
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COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
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COM Express® Type 7 Reference Carrier Board in ATX Form Factor
Express-BASE7
The Express-BASE7 is an ATX size COM Express Type 7 reference carrier board. Together with the COM Express Type 7 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
