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- Virginia Panel Corporation
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Module Accessory Kit, Quantity 26 2-56 x .187" Socket Head Cap Screws
510109305
Used with modules: 510104128, 510104133, 510104134, 510104135, 510104136, 510104139 and 510104261.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Burn-in and Test Sockets
Loranger International Corporation
Loranger International Corporation designs and manufactures thousands of socket styles for the burn-in and test of semiconductors and electronic components. Some of the socket styles are listed below.
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Burn-In Board Tester
Focus-275
Focus275 is a tester for burn-in board.It can improve reliability of burn-in board by inspecting boards for burn-in test by Focus275 regularlyBoth short open test and component test can be done by sending electric signals for special socket contactor and edge part.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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BIB Loading
FALCON Series
The Falcon Series is an automated BIB loading and unloading machine. It is designed to provide precise high-speed loading of DUTs from Trays/Tube to Burn-in boards and precise high-speed unloading of DUTs from Burn-in boards to Trays/Tube for different device packages. The Falcon Series also has a simple conversion kit which allows end-users to re-configure the equipment for different types of sockets and package combinations.
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QFN/QFP35 Sockets
Test sockets are designed for testing today’s high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Burn-In Test
Trio-Tech provides a comprehensive range of semiconductor testing services through its state-of-the-art laboratories in the Far East. The laboratories provides static and dynamic Burn-in /HTOL /SLT testing and other testing services. All of the company’s testing facilities are ISO9001, ISO14000, ISO17025 and DSCC certified ensuring that operating policies and procedures meet stringent international standards for consistency and reliability.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Memory Burn-in Tester
B6700 Series
B6700 can test as many as 48 burn-in boards in parallel at speeds up to 10 MHz, which helps memory suppliers get their newest products to market faster while also reducing testing costs. An original high performance chamber improves yield by assuring high temperature accuracy while generating high temperature. It also shortens the temperature rise and fall time which leads to shortening the test time.
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Memory Burn-In Tester
H5620/H5620ES
As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
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Burn-In Systems
OPTIMUM Series
Advanced Microtechnology, Inc.
The OPTIMUM product line of burn-in systems has a model to meet your individual testing requirements. Please select one of the models below for more specific information
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Test Sockets
QFN/QFP
For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Test Sockets
BGA/LGA
There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Module Sockets
Ardent Optical Engine
The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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Test Sockets
Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Burn-in and Stress Screening Chambers
KDR
Supervise the operation of your product, electronic device, circuit board, or medical device while they are stress screened, burned-in, or temperature cycled inside a Bemco Kardburn or Koldburn glass front chamber. With a huge amount of testing or storage space within instant reach, KD Chambers provide a compact and attractive alternative to a walk-in chamber.
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Inverter Socket
Series 6621
Inverter Sockets. Inverted configuration allows the socket to be wave soldered on the component side of the PCB and the device socketed through a window on the solder side of the PCB. Available on .600 [15.24] centers. Consult factory for other sizes.
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Socket Phone
Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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Multi-Wafer Test & Burn-in System
FOX-XP
The key features of the new FOX-XP test cell that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 "Universal Channels" per wafer, which allows the system to test all the devices on the wafer in parallel. The new "Universal Channel" architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Test Sockets
MEMS Device
Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Smart Sockets
Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Burn-In Boards
Meets burn-in requirements, including extreme temperatures or continual handling. 2 or more layers of polyimide. 200 C maximum temperature. Gold-plated connectors.
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RF Socket
With unparalleled technology, coaxial structure, and high-precision machining equipment, LEENO can provide RF test socket with high bandwidth, impedance matching and high frequency up to 40GHz.
