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Defect
other than specified, imperfection .
- Pickering Interfaces Inc.
product
PCI Fault Insertion Switch Cards
Pickering's PCI Fault/Signal Insertion Switch Cards feature a breakout arrangement that allows faults to be attached to the sensor lines, this includes the breaking of a connection or the adding of defect all of which can simulate connectivity problems in the system.
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Contactless Lifetime Measurement and Inhomogenities Device
MWR-2S-3I
Lifetime determination is based on measuring photoconductivity decay after pulse light photo-exciting with usage of reflected microwave as probe.Simultaneous IR light transmission gives possibility to detect any inhomogenity insidesilicon brick and made 3D image of defects.
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MT Inspection Scope
Um
● Test 12 or 24 fiber MT Connectors● Find Endface defects fast● 800x Magnification●Numbered Dial Indicator to quickly identify which fiber you're onThe Um MT Inspection Scope accurately shows defects in your MT 12 or 24 fiber connectors. Quickly view each fiber to save time and money. Our unique Fiber Dial shows which fiber you are inspecting. No more getting lost!The Um MT is compatible with our Eagle Inspect Software. Create reports with images for your MT connectors.
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Thermalyze Extension for Steady State Analysis
Lock-In
Steady-state thermography is limited to detecting hot spots that heat up a minimum of 100 mK (0.100°C). This may be useful for locating shorts on high-power devices, but is inadequate for detecting low power defects such as semiconductor device leakage current or short circuit with very low or very high resistance. Steady-state thermography also suffers from poor spatial resolution as the heat from localized hot spots diffuses rapidly, blurring the location of the heat source.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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OLED Testing & Inspection
OmniPix-OL1000
Unprecedented optical, spectral, and structural OLED data.All at high-resolution, all correlated. Measure optical, spectral, and topographical properties of OLED pixels and defects. Maplarge scale panels for defective areas. Inspect pixels features and a variety of defects.
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Multi-Layer Analysis for Next Generation PONs
Multi-ONU Emulator
The NG-PON Xpert multi-layer analyzer is a unique, real-time protocol analyzer for XG-PON1, NG-PON2 and XGS-PON networks and products. The Multi-ONU Emulator introduces a new revolutionary approach for comprehensive testing of an OLT. It enhances the testing with repeatable test scenarios and functionalities that cannot be tested in any other way, including the OLT's ability to handle various ONU models and configurations, error and defect conditions, alarms and traffic loads.
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Translating process images into significant tool-defect reduction
Trans-Imager
Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Solar Wafer Geometry and Surface Inspector
7201
The Chroma 7201 was designed to measure wafer lengths, widths, diagonal, orthogonal and chamfer size and angle, it is also capable to detect surface stains. User friendly software and GUI enable versatile parameter setting and result, it also provides a defect display and storage function for further analysis or potential MES/CIM integration.
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X-ray Inspection System
X-eye SF160 Series
High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Axis Play Tester
PMS 3.5 | VP 225012
Maschinenbau Haldenwang GmbH & Co. KG.
The axis play tester PMS 3.5 is used to reliably determine defects and wear on steering parts, wheel bearings, suspension and suspension by counter-rotating transverse and longitudinal movement of the test plates. The built-in hydraulic drive ensures a powerful and even movement of the test plates. An automatic mode and other different operating modes make the PMS 3.5 easy to use.
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Reject Station for X-Ray Image Analyser
IV-110I
IV-11OI is a reject station for X-Ray Image Analyser known for having an X-Ray Image Wire Defect Detection and a compact and space-saving dimension.
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Post Wire and Die Bond Inspection Machine
IV-E1700
IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Large Surface Defect Gauge
4D InSpec® XL Surface Defect Gauge
The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
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Manual Testing
TestingXperts brings in a unique blend of testing processes, tools & technology expertise, and domain knowledge to ensure that the product is delivered without defects in accelerated time frame. TestingXperts provides end to end manual testing services for your functional testing needs with a foundation of matured test processes, in-house accelerators and experience of all industry-leading functional testing tools.
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Front and Back Side Topography Defect Detection
LIGHTsEE
High throughputNanometer range vertical sensitivitySimultaneous double side inspectionNanotopography and Topography measurementDetection of Slip lines, particles, Hairline cracks, SOI voids, Comets, EPI defects…Compliant with thin or thick wafers, taiko wafers, highly warped wafers
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Surface Defect Inspection System
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Cross Sections and Metallography
Rocky Mountain Laboratories, Inc.
Cross sections are prepared by mounting samples in epoxy and then grinding and polishing the mount for imaging in the optical microscope or Scanning Electron Microscopy (SEM). Valuable information from cross sectioning can include: film thicknesses, inclusions, corrosion thickness, dimensional verification, and subsurface defects. Metallographic cross sections are typically etched to reveal the microstructure. Microstructural analysis can provide information about heat treatment history, corrosion susceptibility, as well as undesirable microconstituents.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Software
Interface Analysis
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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MPI Sorter Series
MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Thermal Shock Chambers
We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
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Textile Testing Instruments
Dongguan Amade Instruments Technology Co., Ltd
Textile testing instruments are developed to determine the quality and performance of various fibrillar component fabrics, structural fabrics, garments, home textiles and other textiles by physical and chemical methods in conformance with international standards. By using scientific testing methods to judge the quality of materials or final products, manufacturers of textiles are capable of detecting the defects and unqualified products to correct problems in time, conducive to reducing loss and maintaining the business reputation. Testings cover tensile strength, tearing strength, seam slippage, joint strength, bursting strength, resistance to wear, pilling resistance, color fastness to washing, rubbing fastness, light fastness, color fastness to perspiration, dimension stability, inflaming retarding test etc.
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Precision LCR Meter (20Hz to 2MHz)
ST2840
ST2840 series pricision LCR meter innovatively adopts a new generation of technologies such as dual CPU architecture, Linux bottom layer, 10.1-inch capacitive touch screen, built-in instruction which effectively solves the defects of slow LCR test, single display and complicated operation in the past.The measurement frequency of ST2840 series is from 20Hz-500kHz/2MHz, which makes up for the shortcoming of lack of high-performance bridge in the frequency range of 500kHz.
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Circuit Breaker Time Interval Meter
Measuring contact timings is useful for finding the contact bounces and non-simultaneity of contacts. This helps in finding the possible electrical or mechanical defects in the circuit breaker contacts. Timing analysis also make it possible to detect incorrect mechanical adjustments and wear phenomena of the circuit breaker by measuring the differences between the fastest and slowest phases.
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Thermal Cycling Test Equipment
Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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Non-contact Ultrasonic Testing System
Yamaha Fine Technologies Co., Ltd.
Contact-free inspection through ultrasonic transmission detecting air bubbles, separation, and foreign materials inside workpieces. With a Yamaha ultrasonic amplifier installed, contact-less inspection in the air is realized. Without damaging or wetting the workpiece, it is possible to inspect the workpiece for packing defects, air bubbles, and even flaw depth.
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Pinhole Detection Devices
ElektroPhysik Dr. Steingroever GmbH & Co. KG
The coating control by means of pore testing makes use of electrical voltage in order to uncover microscopically small defects (> 20 μm) in the coating of a surface. If even a small defect can be detected during pore testing of surface coatings, urgent action is required. Minimal flaws in the coating are sufficient to cause great damage.
