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- Virginia Panel Corporation
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Vertical Hinged Mounting Frame, G2, 5U, 3 Position, (2 Blank Plates Included)
310113391
This G2 3-position Vertical Hinged Mounting Frames is for use with standard rack or PXI chassis. It attaches to flanges supplied by the chassis manufacturer and allows the receiver to bolt directly on the mounting plate. Special alignment hardware is not required.
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50 KN Capstan Grips For Rope
These 50 kN (11,000 lbf) capstan grips are designed specifically for testing the tensile properties of rope with a diameter between 8 and 28 mm (0.31 and 1.1 in). The upper and lower grips incorporate an easy-to-load split drum and the upper grip has a counterweight attached to maintain alignment of the grips with the axis of the universal tester during testing.
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Digital Single Fiber Fusion Splicer
*High resolution LCD display*PAS technology*Core or cladding alignment*Double heaters*30 Sec. Tube-heat time*3 magnification modes, max. 360 magnification*Four display modes, fiber core visible*8 Sec. Splice time*Li-ion battery*Max. Wind velocity of 15m/s*Splicing method: Auto, manual*Store 8000 groups of splice results*USB interface
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Confocal FLIM System
DCS-120
*FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Two Fully Confocal Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
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Capacitance Sensor Systems
MTI Instruments offers high resolution capacitance sensors, probes and systems that generate low noise, highly accurate and high stable measurements. Our Capacitance sensor line-up offers accurate measurements for automated inspection applications such as thread quality inspection, disk drive run-out, leveling or flatness measurement, lens alignment, tire run-out and bulging. Our Accumeasure capacitive sensors offer large stand-off distance that includes single and multiple channel rack systems that connect up to 10 capacitive sensors or capacitance probes with individual analog measurement outputs. We also offer cost-effective customized capacitive sensor amplifier board and probe system for easy integration. Our inspection systems linearity exceeds 0.01% full scale measurement (FSM) and resolution to sub nanometers.
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Pinpoint Laser Systems Products
The Microgage PRO is the next generation in laser measuring and alignment tools. This extremely versatile measuring and alignment tool combines key features and capabilities into one portable, compact, easy to use, product for multiple industries. A precise laser beam forms a straight reference line for a machine or assembly and each receiver measures in two axial directions, horizontal and vertical (X & Y).
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Core Alignment Fiber Fusion Splicer
SH-FS170H
Shenzhen Sharingtek Communication Co., LTD
●It adopts German technology with core alignment system and independent property rights.●The equipment takes advanced PAS technology not only can be used to FTTX also meet the requirements of trunk line with good properties of mini size four motor drive light weight fast speed.Features●Hardness - The body is made from titanium alloy and it has rubber protection function quakeproof waterproof dustproof .●Fast - 7s fast splicing 15s fast heating support continuous heating average efficiency improve 2-3times.●Long lifetime - 200 fiber splicing no memory effect lithium batteries the fiber cleaver has 24 blade longer lifetime.
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Over-the-Air Radio Waveform Analyzer Service
DiagnostX
Service enables LMR managers to have all of their active radios evaluated for performance and alignment Over-the-Air, without user intervention. A detailed monthly report will be sent identifying those radios as “Failed”, “Passed” and “Never Received”. This service supports P25 Trunked, P25 Conventional and Legacy systems. Available January 2018
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Osprey Probe Card
The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design. The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.
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Full-Automatic Testing Machine for Hard Board Vehicles
U800HDIR
. CCD automatic alignment, with an accuracy of ± 10μm2. Support layout test, displacement function3. The upper and lower jigs X, Y, θ are automatically fine-tuned to improve the yield4. Optional laser marking5. Support SHOPFLOOR report output6. Optional BARCODE READER
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Pneumatic Capstan Grips For Yarn And Cables
These pneumatic grips are used for tensile testing yarn and metal cables and hold specimens using a capstan design. Initial tension can be applied to the specimen to aid sample mounting and alignment and the pneumatic action enables quick and easy specimen insertion.
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725-Watt (270VDC input) DC/DC Converter, SOSA™ Aligned, 3U VPX
VPX57HS
NAI’s VPX57HS-31 is NAI's latest +270 VDC Input, VPX DC/DC Converter. The VPX57HS was developed in alignment of the SOSA™ Technical Standard and is capable of handling up to 725 Watts of output power. It plugs directly into a standard 3U VPX chassis with a VITA 62 1.0” power supply slot. This off-the-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.
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Inspection & Alignment Services
As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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Display Color Analyzer
Model 7123
Luminance and chromaticity measurement of Color Display0.005 cd/m2low luminance measurement (A712301)Wide luminance range: 0.0001 to 25,000 cd/m2 (A712301) 0.01 to 200,000 cd/m2 (A712302)High accuracy measurementMaximum 9 display modes: xyY, TΔuvY, u’ v’ Y, RGB, XYZ, Contrast, ProgramAble to control Video Pattern Generator and UUT (Unit Under Test)Built-in contrast measurement function to calculate the contrast ratio directlyEquipped with programmable test items that can complete the planned tests with one single buttonSupport USB flash disk that can copy the test procedures to other station for useJudgment function embedded to judge the test result automatically with one single buttonCalibration period setting and reminding functionMemory for storing 100 channels of standard color data and calibration dataBuilt-in flat display calibration data LCD-D65 & LED-D65* to be applied for chromaticity measurement instantlyOptional display white balance alignment system can be used to integrate all optical test stations to one single station
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ADAS and Allignment
Is the precise physical alignment, testing, and electronic aiming of sensors that collect data to inform your vehicle’s advanced driver assistance systems (ADAS).
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Sensor Options
Panasonic Industrial Devices Sales Company of America
Panasonic offers convenient peripheral tools and devices such as a universal sensor mounting stand, sensor checkers for beam alignment, sensor controllers and power supply unit to improve productivity.
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Vector Field and Multi-Axis Systems
Cryogenic vector magnet systems allow precise alignment of the magnetic field to an exact direction in a measurement sample. The system provides the capability of orienting the magnetic field to any vector direction. This is suitable for experiments where samples cannot be moved easily.
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VR/AR/MR Calibration Platform
AR, VR and MR device calibration is critical for product performance. Leverage Averna’s standardized alignment platform to efficiently calibrate cameras and Inertial Measurement Unit (IMU) modules with supreme accuracy. Easily customize or upgrade the base platform into the automated quality solution to best fit your manufacturing requirements.
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CCD Foundry Services
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Absolute Quantum Gravimeter
The Absolute Quantum Gravimeter is the only quantum gravity sensor available on the market place. Thanks to its disruptive technology, this instrument offers unique features:*Absolute gravity measurement at the µGal level.*Automated Continuous Data Acquisition for several months. No long-term drift.*Excellent immunity to ground vibrations thanks to an active compensation system (no mechanical isolation).*Easy and quick operation : the AQG is ready to measure within 1h (no laser alignment nor mechanical assembling, no preliminary pumping, no superspring). User-friendly software requiring no knowledge in quantum physics.*Compact and transportable sensor.*Low maintenance constraints (in particular, no moving parts in our vacuum chamber).*Station to station repeatability of the absolute measurement within a few μGal.
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Radar Cross Section (RCS) Measurement and Evaluation System
XRC
KEYCOM develops various radars for versatile applications based on its knowledge and expertise on millimeter wave and microwave technologies. KEYCOM’s product line of radars includes Radar Test Systems (RTS) to evaluate distance accuracy or output, Radar Alignment Systems (RAS) to help you adjust the alignment of radars, and Radar Cross Section (RCS) measurement systems to measure RCS of such radar targets as aircraft, ships and automobiles.
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CSlaser | CTlaser Series Infrared Thermometer
The infrared thermometers of the optris CSlaser/CTlaser series consist of an innovative double laser sighting, in contrast to many IR thermometers with single lasers which only mark the center of the spot. The two laser beams follow the infrared optical path to mark the position of the measuring field at any distance. At the focus point both lasers are crossing – this greatly supports an exact alignment and reduces measurement errors. The infrared thermometers of this class are mainly used in industrial areas as well as in research and development. Small measurement field sizes are of great importance for precise temperature measurement. A number of different focus versions allow a flexible adjustment for the different applications.
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ADAS System
Is the precise physical alignment, testing, and electronic aiming of sensors that collect data to inform your vehicle’s advanced driver assistance systems (ADAS).
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Tunable, Pulsed IR SW & LW OPO IR Source
Firefly-IR
Firefly IR is available in short-wave and long-wave models, providing broad wavelength coverage from 1.4-8.5 µm. The compact and sealed design requires no manual alignment, and can be used in a variety of applications in the lab and in the field. Wavelength selection and scanning is automated and performed via web browser or using a TCP/IP command set. Pulsed operation and high repetition rate provide high peak power and rapid data acquisition.
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CamTrac Z-Axis Test Fixture Kits
CT Serie
The CT Series Mechanical Kits, utilizing the patented CAM mechanism1, offset the same precision linear motion. The 'Z' axis motion is ideal for a larger point count mechanical test applications.The CT Series features a hinged 3/8" FR4 probe board, tooling holes for precision alignment, removable sides, precision shafts and cam slide block assemblies, and a pan latch assembly.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Shaft Alignment
EVO
The evolution of laser shaft alignment towards simplicity and confidence continues with the EVO.
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Automated Front & Backside Mask Aligner System
Model 6000
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Double Arm Alignment Automatic Testing Machine
U820
1. CCD automatic alignment, the alignment accuracy reaches ± 2.5μm2. Support layout test, displacement function3. The upper and lower jigs X, Y, θ are automatically fine-tuned to improve the yield4. Optional laser marking5. Optional SHOPFLOOR report output6. Optional BARCODE READER
