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Particle Deposition Systems
MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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PLD/PED Components
Neocera offers a variety of components that can be fitted and combined into new or existing PLD and PED systems to provide improved functionality and enhanced capability. Components include:*Oxygen-compatible substrate heaters for epitaxial oxide film depositions..*Automated Target Carousels for preparing multilayer heterostructures.*Deposition chambers design specifically for PLD and PED systems.*Manual and automated laser window-change Accessories.*Pulsed Electron Deposition (PED) sources for laser transparent materials.*Ideal for retrofitting existing systems or construction of new systems.
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Metrology System
Aspect
Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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Process Particles Suspensions
Process Particles™ Suspensions are used as particle material standards. They represent real-world contaminant particles encountered in semiconductor device fabrication processing. Deposition of these particles on wafers and reticles enables characterization of the material-dependent response of a surface inspection system when accurate particle size or particle sphericity are of secondary importance. They consist of broad size distributions of irregularly shaped solid particles suspended in ultra-pure water (UPW). Each bottle contains a suspension volume of 100 mL.
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Metal-Organic Compound Chemical Vapor Deposition
Model MOCVD-500-A
For Experimental growth of quality epitaxial layers III-V, II-VI compounds. Multi-Layer structures. Directly heated silicon carbide coated, high purity graphite or PBN susceptor. Low mass thermocouple probe immersed into susceptor. Broad temperature and pressure application. Highest quality materials utilized throughout.
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GHW Series 13.56 MHz, 1.25, 2.5, And 5.0 KW High-Reliability RF Plasma Generators
The GHW Series RF power generators deliver maximum rated output powers of 1250, 2500 and 5000 Watts at a frequency of 13.56 MHz. The GHW generators offer field-proven reliability, exceptional stability, and unsurpassed repeatability for high uptime and process yield. They are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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In-Situ Spectroscopic Ellipsometer for Real-Time Thin Film Monitoring
UVISEL Plus In-Situ
The UVISEL Plus in-situ spectroscopic ellipsometer can be easily mounted on process chambers (PECVD, MOCVD, sputter, evaporation, ALD, MBE) for the real-time control of thin film deposition or etch processes.The UVISEL Plus in-situ provides the unique combinations of very high speed, sensitivity, dynamic range and accuracy making the instrument able to control deposition / etch at the atomic layer thickness level, even for rapid processes.
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Chemical Vaper Deposition R&D System
MODEL CVD-300-M
High Temperature, 1080 C (24" Hot Zone: 126 Cubic In.) High Purity Quartz Tube with Water Cooled End Caps. Broad Pressure Range of Atmosphere to 10-3 Torr. Upgradable to High Vacuum. Computer Interfaceable. Small Footprint (26" x 48"), Portable with caster mounts.
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Matrix Vapor Deposition System
iMLayer
The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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kSA BandiT
The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Microelectronics And Packaging AOI
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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High-grade type Gas Monitor for Chamber Cleaning End Point Monitoring
IR-400
The IR-400 offers real-time monitoring of the chamber cleaning end point during the deposition process. By optimizing the cleaning process, the IR-400 reduces cleaning time and gas usage. This reduction in cleaning gas usage leads to a reduction in chamber damage and increases the life times of all the systems components.
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Plasma CVD & Etching Systems
MODEL DRIE-1000
A High Quality Plasma Deposition & Etch System, Ideal for R&D and Small Scale Production. Modified designs with capabilities of 12" wafers. Substrate heating to 500 C. Top loading / Optional loadlock. Multifunctional plasma network. Diversified pumping configurations. Variable electrode spacing. Customized features and components for specific applications.
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Ion Beam Deposition
Create ultra-precise, high-purity, thin film layer devices with maximum uniformity and repeatability with Ion Beam Deposition (IBD) Systems.
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A Highly Versatile R&D Bell Jar Thin Film Coating System.
MODEL VES-3000
TEK-VAC's VES-3000 coater station model offers a modular concept for thin film deposition. Common PVD techniques which can be employed in this compact unit include thermal and electron beam evaporation. A 2KVA SCR controlled filament evaporation power supply is provided. Optional ion deposition and magnetron sputtering devices can be incorporated in the system.
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Pure Boron Foils
MICROMATTER™ boron foils are also produced by laser plasma ablation; however, the deposition process is much more complex and time consuming than that for diamond-like carbon. Accordingly, only thin films, mainly designed for beam stripping of heavy ions in electrostatic accelerators, are available. All films are generally delivered on glass substrates coated with a release agent.
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High Temperature Absolute Pressure Transducers
Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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Panel Light-I-V Teste
ASIV-11
Greensolar Equipment Manufacturing Ltd.
The Panel Light-I-V Tester (ASIV) is used to test photovoltaic panels or modules during their production. A flashlight illuminates the work piece with similar light spectrum to that of the Sun, while the electric performance of the unfinished panel or the finished module is accurately measured. With the help of the tester the user can filter out reject panels. Testing the final performance reveals changes made by alternations in the deposition recipe.
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Copper PCB
The Amitron process is capable of producing 20 plus ounces of finished copper and reliably spray coat a protective and consistent solder mask with imaged nomenclature. Amitron utilizes a unique process referred to as "Laminated Deposition". This combination of processes allows extreme copper thickness requirements to become very practical and cost effective. The process utilizes heavy base copper that when placed in our plating and etching systems will deliver consistent and reliable high power circuits.
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Differential Quartz Crystal Microbalance
Dike
During an experiment to detect an affinity reaction on biological material, a molecule of interest is attached to the quartz crystal of the measurement channel, this deposition can be achieved by direct binding or by capture through another protein, the result of this process is to make the quartz sensitive to the molecule to be detected.
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Dimensional Metrology
Stand-Alone Metrology Family
Nova Measuring Instruments Inc.
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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Liquid Flow Controller
Built upon field proven technology, the Turbo™ Liquid Flow Controller (LFC) 2950 was engineered to pair with MSP Turbo II™ Vaporizers to provide a reliable, high-performance liquid vapor delivery solution for semiconductor thin film deposition processes (including CVD, PECVD, ALD, and MOCVD). The diagram below shows how the LFC fits into the liquid vaporization system MSP offers.
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High Power Microwave Plasma Source
The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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Ozone Gas Generators
SEMOZON® Ozone gas generators and subsystems are the industry standard for compact, high concentration, ultra-clean ozone gas generation. Applications include Atomic Layer Deposition (ALD), Atomic Layer Etch (ALE), Chemical Vapor Deposition (CVD) and Wet Cleaning.
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2 MHz RF Plasma Generators
NOVA® Series
The NOVA ; RF Plasma Generators are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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Vapor Concentration Monitor
IR-300 Series
Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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Parylene Deposition Equipment
SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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Magnetic Measurement
DiskMapper H7 System
The DiskMapper H7 system quickly determines the uniformity of the perpendicular recording layer of Heat Assisted Magnetic Recording (HAMR), also called Thermally Assisted Recording (TAR) disks, immediately after deposition, an important factor in the yield of disk drives. Utilizing a custom 7 Tesla bi-polar high speed superconducting magnet, the hysteresis loop of any disk location can be measured in less than 3 minutes.
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Burnbox & Scrubber Systems
MODEL BBS-10-LM
Safe, low costing, and minimal maintenance exhaust gas abatement equipment designed for years of continuous operation. Systems designed to significantly diminish toxic, corrosive, flammable, and pyrophoric gas exhaust to safe levels. Ideal for treating the exhaust effluents from process systems such as a deposition and etch reactor. Burnboxes, scrubbers and combinations are available, tailored to suit your exact requirements.
