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- Applied Rigaku Technologies, Inc
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Process EDXRF Spectrometer
NEX LS
Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.
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Concrete Coating Thickness Gauge
500
The Elcometer 500 Coating Thickness Gauge accurately measures the thickness of coatings on concrete and other similar substrates* - non destructively.
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FR-4 PCBs
Monthy Capability: 1200 Sq M/MonthLayer: 4 LayersMaterial: FR4 TG140Dimension: 335.14mm*245.65mmFinished board thickness: 1.6mm+/-0.13mmFinished copper thickness: 2ozMin Trace Width/Space: 8/8milMin hole size: 0.3mmMin hole wall copper: ≥25UMSoldermask Color: YellowSurface finishing: HALApplication field: Consumer electronics
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Thickness Gauges
CMX
The CMX has all features of the MX & MMX gauges with a ton of advanced features. Measure material and coating thickness simultaneously, while still detecting pits & flaws in a single mode (PECT). Auto probe zero, auto probe recognition, auto temperature compensation are also included. Selectable Large Digits and B-Scan display options, up to 64 custom user definable setups, selectable transducer table for precision linearity, and material and coating calibration options are also available.
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Paper Thickness Tester
DRK107A
Shandong Drick Instruments Co., Ltd.
DRK107A Paper Thickness Tester is professionally applied to testing the thickness of paper specimens.
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Acoustic Microscope
AMI D9650Z
The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8822
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1000um- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm - Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AA(UM-3)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 160x68x32mm- weight: 250g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Micro XRF
W Series
The W Series Micro XRF uses poly-capillary optics to focus the X-ray beam to 7.5 µm FWHM, the world’s smallest beam size for coating thickness analysis using XRF technology. A 150X magnification camera is used to measure features on that scale; it is accompanied by a secondary, low-magnification camera for live-viewing samples and birds-eye macro-view imaging. Bowman’s dual-camera system lets operators see the entire part, click the image to zoom with the high-mag camera, and pinpoint the feature to be programmed and measured.
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Individual Precision Foils
Elcometer 990
Calibration foils or ‘shims’ are the most convenient way of creating a coating thickness standard on the substrate material, surface finish or form.
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WAFERMAP
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Thickness and Flaw Inspection
FOCUS PX / PC / SDK
Olympus offers a complete advanced phased array integration solution that meets the requirements of your most demanding customers. The solution includes the FOCUS PX, a powerful and scalable acquisition unit; FocusPC, a powerful data acquisition and analysis software program; and three software development kits (SDK), FocusControl, FocusData, and OpenView SDK, to customize your software interface based on your application and control FocusPC for a fully automated inspection solution.
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Ultrasonic Thickness Gauge
QTG Series
Ultrasonic Thickness Gauge - QTG Series are economical, user-friendly, menu driven, and multi-functional units offering extensive features from basic measurements (model: QTG I) to extended memory (5000 reading storage) and USB output capabilities (model QTG II). The instrument can measure with very high resolution (0.01 mm or 0.001 inches) the thickness of metallic and non-metallic materials such as steel, aluminum, titanium, plastics, ceramics, glass and any other good ultrasonic wave conductor. The Ultrasonic Thickness Gauge - QTG Series accurately displays readings in either inches or millimeters and is equipped with special features like Automatic recognition of probes with different frequencies and Automatic zeroing of the unit.
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Ultrasonic Thickness Gage
27MG
The Olympus 27MG is an affordable ultrasonic thickness gage designed to make accurate, measurements from one side on internally corroded or eroded metal pipes, tanks, and other equipment. It weighs only 12 oz. (340 g) and is ergonomically designed for easy, one-hand operation. Thickness range 0.50 mm to 635 mm (0.020 in. to 25.0 in.) depending on material, transducer, surface conditions, temperature.
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Position / Distance / Proximity Sensors
Panasonic Industrial Devices Sales Company of America
Easy-to-use Inductive Proximity Sensors provide stable detection for automation, with Sensors for standard to high speed, high performance solutions. These Inductive Proximity Sensors detect the presence and position of ferrous and non-ferrous metal objects and come in a range of IP Ratings (IP50 / 67 / 68 / 68g). The IP68g enclosure allows usage in very harsh environments. For high speed, high accuracy measurement, Laser Measurement Sensors are ideal for the precise measurement of thickness, diameter and height. Panasonic’s HG-C Series CMOS Type Micro Laser Distance Sensors deliver high repeatability for measurement distances (center) of 30mm, 50mm, 100mm, 200mm and 400mm. Ideal to measure insertion depths or thickness, these Sensors can also be used to detect warping, overlaps and presence helpful for preventative maintenance and remote monitoring. Select models are IO-Link compatible for ease of use.
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FPP Software
Four Point Probe
Materials Development Corporation
For use with a manual four point prober, the MDC FPP Software operates in a convenient, single screen that displays both measurement parameters and testresults. The FPP software can measure Resistivity, Conductivity, Resistance, Doping, Thickness, and SheetResistance when used with a compatible current source and voltmeter or SMU.
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Wire and cable slicer
CX-18
Shenzhen Chuangxin Instruments Co., Ltd.
Wire and cable slicing machine is a kind of used products factory la bequipment. Using mechanical transmission feed, blade cutting structure, it can be cut1 to 12 mm range plastic various thickness, sheet material, etc., they are availablRubber, leather material and hardness of the material must be sliced, the machine is widelyUsed in rubber, plastic, leather, electric wire, cable, scientific research units, etc.
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Matrix Vapor Deposition System
iMLayer
The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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Profilometer
MicroCam™
MicroCam™ fiber-based optical non-contact 3D profilometers deliver: High-Speed Non-Contact Surface and Cross-Sectional Inspection 3D Online Measurements, GD&T and Imaging Long Stroke Profilometry with Sub-Micron Resolution Thickness, Roughness and Vibration Measurements Fiber-based Probes which reach into Bores, Tubes, and Crevices
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Falling Dart Impact Tester
FDI-01
Jinan Leading Instruments Co., Ltd.
FDI-01 Falling Dart Impact Testeris applicable in the impact result and energy measurement of the falling dartfrom a certain height against plastic films and sheets with a thickness less than1mm, whichwould result in 50% tested specimen failure.
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Ultrasonic Thickness Gauge
MMX-6
The MMX-6 is a simple to use hand-held Ultrasonic Thickness Gauge with the ability to measure through paint and coatings and eliminate the thickness of the paint or coating. The MMX-6 uses a dual element style transducer. With the single press of a button, the MMX-6 can be switched between pit or flaw mode ( pulse-echo), and through paint/coatings mode (echo-echo) for maximum inspection efficiency. The MMX-6 is equipped with a bundle of features to make your job easier: Alarm mode, high speed scanning, and data send are the main features of the MMX-6. The MMX-6 comes as a complete kit, ready to use, and is backed by Dakota Ultrasonics 5 year limited warranty.
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1 KN Capstan Grips For Yarn And Wire
These capstan grips are applicable for tensile testing yarn and metal wire with thickness less than 3 mm (0.12 in). Flat grip faces are used to hold the specimen. The grip faces are opened and closed by a cam with an operating lever. Ease-of-use and simple design are advantages of these 1 kN capstan grips for yarn.
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Wafer Thickness Measuring System
WT-425
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Camera Endpoint Monitor based on Real Time Laser Interferometry
LEM Series
Our Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/deposition process.Depending on applications, LEM camera includes a 670 or 905 or 980 nm laser and when mounted on any dry etch/deposition process chamber with a direct top view of the wafer this generates a small laser spot on the sample surface.Interference occurs when monochromatic light hits the sample surface, resulting in different optical path lengths due to film thickness and height variations in the film.This allows the etch/deposition rate and thus thickness to be monitored in real time, also fringes counting or more complex analysis, providing enhanced process control Endpoint for a wide variety of processes. Additionally interfaces can be detected by their change in reflectivity.
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SnowScan
SnowScan®
Ski Resort snow management use SnowScan® to evaluate snow thickness in real time, resulting in lower snow making costs and better snow conditions.
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Wet Film & Powder Thickness
When applying a liquid coating, by measuring the uncured film thickness, it is possible to determine the eventual dry film thickness. Applying too much coating wastes time and materials. It can also affect the performance and finish of the product. Too much wet film can cause the coating to crack as it cures; too little coating increases the risk that the substrate will not be sufficiently protected, leading to rust spots.
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Ultra-minute Photoelectric Sensor
EX-Z
Panasonic Industrial Devices Sales Company of America
At a thickness of 3mm, the EX-Z Series is one of the world's thinnest Photoelectric Sensors with a built-in amplifier which was achieved by utilizing a new Semiconductor packaging technology that does not use wire bonding. The compact design now makes it possible to install the sensors in narrow spaces that, in the past, could fit only a conventional fiber sensor head.
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Ultrasonic Thickness Gauge
SONOWALL® 50
The SONOWALL 50 features a highly accurate data read out and a large measurement range. An integrated data logger and its user-friendly operation make the device ready for a wide variety of applications. The included software is a convenient tool to store and evaluate the measurements.
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Thickness Tester
Shenzhen UYIGAO Electronic Technology Co., Ltd
The coating thickness gauge is designed for non-destructive, fast and precise coating thickness measurement.
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Spread Resistance For Slanting Polished Sample Of Semiconductor By Tow Kinematically-mounted Probe Contacting .
SRS-2010
*Resitivity map along with depth direction, thickness of epitaxial , depth of PN junctin and carier density profiles
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Industrial Paint & Powder Thickness Gauge
415
Incredibly fast (60+ readings per minute), reducing inspection times, increasing productivitySwitches instantly between ferrous & non-ferrous substrates without interruption1Measures cured paint & powder coatings up to 1000μm (40mils)Zero or smooth (2 point) calibration ensures accuracy on smooth & thin coated substratesEasy to use, ergonomic design provides maximum comfort for continuous useLarge easy to read values in microns or milsAuto rotating large colour display provides clear visibility whatever the angle of measurementScratch, solvent & water resistant display protects against the elementsRugged & resistant to dust or powder coatings equivalent to IP64, ideal for modern industrial & powder coating environmentsTransfer live data via USB or Bluetooth® to ElcoMaster® for instant report generation
