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LGA
IC packaging designed to fit on an array of sockets or SMT soldered.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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33W - Single Output
iCG Series
*DOSA Compatible Footprint*2.4-5.5 Vdc, 4.5-14 Vdc Inputs*0.6-3.63 Vdc, 0.7-5.5 Vdc Outputs*Non-Isolated*Excellent Transient Response*LGA or EPC format*No external loop tuning components needed
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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LGA 1700 Intel® 12th Gen. Core™ Proprietary Server Board with 4 x DDR5, 1 x PCIeX16, 2 x PCIeX4, 5 x USB 3.2, 4 x SATA 3, Quad LANs and IPMI
ASMB-610V3
- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- Compatible with HPC-61 series chassis- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 slot or two PCIe x8 slots support FH/10.5" Length Cards- Two PCIeX4 slots support low profile expansion cards- 4 x SATA 3 ports and 5x USB 3.2 ports- One M.2 2280/22110 (SATA / PCIe compatible)- Quad LAN with Intel I350- Flexible IO board design
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LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI
ASMB-976
- LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor- DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory- 4 x PCIe x16 and 7 x PCIe x8- Intel® X550 dual 10GbE ports- Ten SATA3 and two M.2 connectors (SATA/PCIe compatible)- 0 ~ 40 °C ( 32 ~ 104 °F) ambient operating temperature range
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Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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16.5W to 24.7W - Single Output
iCF Series
*DOSA Compatible Footprint*2.4-5.5 Vdc, 4.5-14 Vdc Inputs*0.6-3.63 Vdc, 0.7-5.5 Vdc Outputs*Non-Isolated*Excellent Transient Response*LGA or EPC format*No external loop tuning components needed
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Silver Button Sockets
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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LGA 1200 Intel® Xeon® W & 10th Gen. Core™ MicroATX Server Board with 4 x DDR4, 3 x PCIe, 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-587
- LGA 1200 Intel® Xeon® W and 10th Gen. Core™ i9/i7/i5/i3 processor with W480E chipset- DDR4 ECC/Non-ECC 2933/2666/2400 MHz UDIMM up to 128 GB- One PCIe x16 and 2 x PCIe x4 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 22110/2280 (SATA / PCIe compatible)- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Dual LGA 3647-P0 Intel® Xeon® Scalable Proprietary Server Board with 12 DDR4, 4 PCIe x16 + 1 PCIe x8+4 PCIe x4, 14 SATA3.0, 8 USB3.0, Dual 10GbE, IPMI
ASMB-975
- Proprietary server board with dual Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 1.5TB, support Intel Optane DC Persistent Memory- 14 SATA3.0 connectors (including two M.2 2242)- Four PCIe x16 slots (Gen3) for double-deck cards- Intel® X557-AT2 dual 10GbE ports- 0 ~ 40 °C ambient operating temperature range
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Universal Programmer Superpro 6100N
Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.
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LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Pick and Place Test Handler
MT9510 XP / x16
The MT9510 XP / MT9510 x16 is a universal pick-and-place handler for packages such as QFP, BGA, Micro-BGA, CSP, TSSOP, PLCC, PGA, LGA, MLP/MLF.
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9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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43.5W to 66W - Single Output
iBF Series
*DOSA Compatible Footprint*2.4-5.5 Vdc, 4.5-14 Vdc Inputs*0.6-3.63 Vdc, 0.7-5.5 Vdc Outputs*Non-Isolated*Excellent Transient Response*LGA or EPC format*No external loop tuning components needed
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LGA 1700 Intel® 12th Gen. Core™ ATX Server Board with 4 x DDR5, 5 x PCIe(1 x Gen 5, 3 x Gen 4, 1x Gen 3), 7x USB3.2, 4xSATA3, Quad/Dual LANs, and IPMI
ASMB-788
- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and four PCIe x4 (3 x Gen 4 & 1 x Gen 3) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Four SATA 3 ports and seven USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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LGA 1700 Intel® 12th Gen. Core™ MicroATX Server Board with 4 x DDR5, 3 x PCIe (1 x Gen 5, 2 x Gen 4), 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-588
- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and two PCIe x4 (Gen 4) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Up Converters
Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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XYZ Color Sensor
AS7261
Calibrated XYZ color sensor provides complete, integrated platform for handheld color analyzers, color calibration and mobile analysis devices. Tri-stimulus XYZ realized by silicon interference filters. UART or I²C slave digital Interface. 16-bit ADC with digital access. Programmable LED drivers. 20-pin LGA package 4.5mm x 4.7mm x 2.5mm, with built-in aperture. Compact true-color sensing. Applications; Color/CCT sensing, Fluid or reagent analysis, Color point comparison, Display calibration.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 5 PCIe x8 or 2 PCIe x16 and 1 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-815
- ATX server board with Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Five PCIe x8 or two PCIe x16 and 1 PCIe x8- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 60 °C ambient operating temperature range
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Microcomputer Module
SX-23BT
The SX-32BT is a Bluetooth® 5.0 Low Energy compatible microcomputer module based on a 32-bit RX microcomputer, the "RX23W", from Renesas Electronics. Certified for North America, Europe, and Japan, the module's design also includes a PCB antenna. Furthermore, it adopts a 0.7mm pitch LGA package, ideal for OEM's looking to increase the efficiency of their manufacturing process while lowering the total BOM cost of their product.
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Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Dual LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 4 PCIe x16 + 2 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-825
- ATX Server Board with dual Xeon Scalable processors- DDR4 2933 MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Four PCIe x16 slots (Gen3) and two PCIe x8 (Gen3)- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 40 °C ambient operation temperature range
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LGA 6096 AMD® EPYC™ 9004 ATX Server Board with 6 x DDR5, 5 x PCIe x16 + 2 x PCIe x8, 9 x SATA3, 7 x USB 3.2 (Gen1), Dual 10GbE, and IPMI
Part No. ASMB-831
- LGA 6096 (Socket SP5) ATX server board with AMD® EPYC™ 9004 processor- DDR5 4800 MHz RDIMM up to 384GB (6 DIMMs)- Five PCIe x16 (Gen5) and two PCIe x8 (Gen5) for four double-deck cards- Intel® X710-AT2 dual 10GbE ports- Nine SATA3 and seven USB 3.2 (Gen1) ports- Two M.2 2280/22110 (SATA / PCIe compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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Dual LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16 DDR4, 4 PCIe x16, 3 PCIe x8, 1 PCIe x4, 4 SATA3, 4 USB3.0, IPMI
Part No. ASMB-622
- Proprietary server board with dual Xeon® Scalable processors- DDR4 3200MHz RDIMM up to 1TB, support Intel Optane Persistent Memory- 1 SFF-8643 connector support 4 ports SATA drive, 1 M.2 2280 on board- 1 SlimSAS connector support 2 ports NVMe drive in option- Four PCIe x16 slots (Gen4) supporting 2 double deck cards with active FAN- Four PCIe X8 slots support 3 PCIeX8 and 1 PCIeX4 signals- Quad LAN with Intel I350- Flexible IO board design
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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LGA 4094 AMD® EPYC™ 7003 ATX Server Board with 8x DDR4, 5x PCIe 4.0 x16 + 2x PCIe 4.0 x8, 9x SATA 3, 5x USB 3.0, Dual 10GbE, and IPMI
ASMB-830
- LGA 4094 (Socket SP3) ATX server board with AMD EPYC™ 7003 processor- DDR4 3200 MHz RDIMM up to 128GB per DIMM- Features 5x PCIe 4.0 x16, 2x PCIe 4.0 x8- Intel® X550 dual 10GbE ports- Eight (via SFF-8643 connector) + one SATA 3 and two M.2 connectors (SATA/PCIe 4.0 compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
