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- LBA Group, Inc
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MW AM Broadcast Mobile Antenna System
TUP-3
The TUP-3 system is capable of transmitting efficiently at carrier frequencies from below 1000 kHz to over 1700 kHz. It is rated for power to 5000 watts, 125 percent modulated. Housed is a weatherproof cabinet, the integral tuning unit features high quality electronic components and matches the TUP-3 system to a 50 ohm transmission line. The self-supporting design of the tower also minimizes erection time and complexity.
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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End-of-Line IC & MEMS Tester
igentic® 841t
Integrated circuit (IC) and micro electro-mechanical system (MEMS) device manufacturers need to address the challenges of today's global market including increased functionality, speed and complexity while delivering components at reduced costs. Sterner Automation's igentic® 841t automated test systems meet these demanding requirements by providing a flexible platform for comprehensive end-of-line IC and MEMS device handling, testing, grading and packaging. The resulting improvements in quality assurance and process efficiency will maximize customer satisfaction and profitability.
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Analog IC test system
A paradigm shift has been occurred in Japan’s major brand WL25 series tester. Ultimate simple system is available by effective analog pin architecture.This cost performance system is covered analog IC extensively, which are high accuracy, speed and multi-site test function.
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Diamondx Test System
Diamondx semiconductor test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.
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AMIDA 3001XP Tester
AMIDA has introduced two new analog/mixed-signal and logic options in the AMIDA-3000 series in recent years—the AMIDA-3001XP and AMIDA-3KS test systems. Both reinforce the AMIDA-3000 series' ability to provide cost-optimized test solutions for a variety of consumer components in power management and mobile device components. The AMIDA-3000 series provides more than twice the number of analog channels of its modules per test system, thus greatly reducing the acquisition cost of each channel and more than doubling the number of analog channels in the entire test system. This results in a higher number of parallel tests and a higher level of capability for this system, as well as a lower and more cost-effective IC unit test cost for this tester. This series of test systems provides a powerful test combination with high-speed hardware and software integration. The built-in instant messaging protocol detection function of AMIDA-3001XP test machine not only simplifies the complexity and difficulty of test development, but also greatly shortens the test time by using its high-speed computing capability.
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Failure Analysis
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Advanced SoC Test System
3680
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Heavy Duty Dynamometers
MD-250-HD
The MD-250-HD series dyno (SE/DE) was designed to be a performance dynamometer first with the added benefit of being able to test 2-wheel-drive heavy-duty vehicles such as truck, buses and commercial vehicles in addition to the standard car or light duty pick-up. The 250-HD is certified in the states of Colorado, Nevada and Utah for use in loaded-mode diesel smog testing programs because of its accuracy and reliability. No other dyno in its class offers more value or better in-house motor vehicle testing capabilities than the Mustang MD-250-HD. For starters, the MD-250-HD boasts a 1,500 horsepower measurement capacity at a top speed of 175 mph and a powerful air-cooled eddy current brake provides the MD-250-HD-SE with 900-hp worth ofloading capacity for steady state testing. Loading capacity can be increased to 1,500-hp via the optional DE model. The 250-HD can be upgraded to the 250-HD-SE-M via the addition of a 100 or 200 hp AC motor for transient testing of electric buses to measure range and regeneration or for emissions testing of IC engines. Do not be fooled by its compact size – the MD-250-HD is a serious dynamometer with serious tuning capabilities. The MD-250-HD uses a powerful eddy current power absorber, a frictionless, air-cooled braking device, to enable it to apply variable and steady state loading. A complete control and data acquisition system lets you design a wide range of tests or select from a host of pre-configured tests included with the standard system. The 250-HD’s four roller design makes setting up vehicles a snap – simply drive onto the 250-HD and let the tires settle in between the rollers. The 250-HD can be installed above-ground or below-ground, it’s your choice. The above-ground system utilizes an optional premium platform and ramp system with an above-ground restraint kit. The addition of an axle pull-down kit help keep the tires from slipping or trying to “climb out” of the rollers.
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Semiconductor & Electronic Systems Test and Diagnostics Services
Reliability Test and Diagnostic services are offered to a wide range of customers that are active as Fabless Semiconductor or Integrated Device Manufacturers, automotive electronics supplier, Telecom and ICT application specialists, Industrial and Medical electronic system manufacturers or in Aerospace and Space applications. Independent high tech test and diagnostic service laboratory. IC and electronic module qualification. ESD and Latch Up testing. Design assessment by HALT/HASS. Failure and construction analysis.
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Advanced Design System (ADS) Core
W2200BP
Advanced Design System (ADS) is the flagship product from Keysight EEsof EDA, the technology and innovation leader in high-frequency, mixed-signal electronic design automation (EDA). It is the only design simulation platform that enables the co-design of IC, package and board in high-frequency and hi-speed applications. ADS seamlessly integrates system, circuit, and full 3D electromagnetic simulation with Keysight's test instrumentation to perform single pass successful electronic designs repeatedly.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Terahertz Analysis System
TS9000 Family
The TS9000 series leverages Advantest's industry-leading terahertz analysis technology and expertise amassed over our decades as a global leader in semiconductor test equipment. This system provides a new high-speed, high-precision solution for measurement and analysis tasks including IC chip mold thickness and IC package / printed board wiring quality, which existing methods cannot measure adequately.
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ESD & Latch-Up Test System
Identify and help correct ESD and latch-up susceptibility issues on sensitive integrated circuit components prior to full-scale production with the Thermo Scientific™ MK.2-SE ESD and Latch-Up Test System. The MK.2-SE test system provides advanced capabilities to test high pin count IC devices to Human Body Model (HBM) and Machine Model (MM) ESD standards. The system’s pulse delivery design addresses wave form hazards such as trailing pulse and pre-discharge voltage rise, and performs Latch-Up testing per the JEDEC EIA/JESD 78 Method.
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Analogue IC Tester
SYSTEM 8 (AICT)
The SYSTEM 8 Analogue IC Tester is the answer to testing analogue devices. The key feature of the AICT is its ability to functionally test all common analogue ICs and discrete devices in circuit. It is also capable of testing all types of analogue and digital components by means of the well-known, power off V-I test technique. For users requiring only the latter function, please select the Analogue Test Station section.
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Mixed signal LSI test system
Multi-pin type model is now launched in WL27 Logic/Power mixed LSI test system.This system is suitable for multi-site test in A/D mixed device such as automotive・motor driver IC. It’s a high throughput and cost performance mixed signal LSI test system.
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Test System
LPDDR4 and LPDDR3
Testing LPDDR4, LPDDR3 devices is made fast and simple with the "Lower Power" LPDDR4/3 TCE-3200LP IC test system. It can be configured up to 32 sites in parallel and integrated with the customer's selected handler.The TCIII-3200LP system can be used as a production tool as well as an engineering tool. To assist manufacturers and integrators, TurboCATS has developed a heat chamber that can be integrated with the TCE-3200LP, LPDDR4 and LPDDR3 test system. This allows the devices to be tested while being exposed to heat conditions.
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Semiconductor Test Equipment
Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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Power/Voltage Rail Probe. 4 GHz Bandwidth, 1.2x Attenuation, +/-30V Offset, +/-800mV
RP4030
The Teledyne LeCroy RP4030 Power Rail Probe meets the specific requirements of those who need to acquire a low-voltage DC signal as part of a:-Comprehensive power integrity, digital power management IC (PMIC), voltage regulator module (VMR), point-of-load (POL) switching regulator, or low-dropout regulator testing- Complete embedded power management system that includes PMICs, VRMs, POLs, and LDOsThe RP4030 will faithfully acquire a low-impedance, low-voltage DC power/voltage rail signal without unduly loading the device under test (DUT), while providing high offset to allow DC power/voltage rail signal display on an oscilloscope with high gain.
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Digital Incircuit Test
PFL780/760
The PFL780 and 760 use IC clips as a test interface. This makes them ideal for the service and maintenance of legacy systems. If you need to work on high density surface mount PCBs you should consider the GRS500 as a more suitable alternative.
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ESD & Latch-Up Test Service
MASER Engineering has automatic test equipment for the most common ESD test pulse models. MIL - JEDEC - ESDA - IEC standards. IC level Human Body Model. IC level Machine Model. IC level Charged Device Model. System level IEC 61000 HBM. AEC-Q100 Field Induced Gate Leakage test. Static Latch-Up test. Dynamic Latch-Up test.
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IC Tester
ICE1
The IC Test System was developed to measure the EMC behavior of circuits (ICs) in the event of targeted field or line-related interference and for measuring emissions. The test IC is tested in function. The test environment ICE1 creates the functional environment of the test IC. The respective measurement task is carried out with the corresponding probe set.
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Pin Point Range Systems
The PinPoint Alpha system is a flexible, adaptable and modular PCB and IC fault finding system, which allows you to apply different electronic test methods to obtain maximum test coverage and fault detection. Test signals can be applied at the PCB edge connector or through test clips and DTIs to perform fixtureless in-circuit testing.
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Regenerative Battery Pack Test System
17040
Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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ESD Test System
58154 Series
ESD (Electrostatic Discharge) Test Systems are PXI/PCI controlled module to simulate electrostatic discharge pulse during electronic device testing. The 58154 series offer both ESD STM5.1-2001-Human Body Model and ESD STM5.2-1999-Machine Model. The user friendly software offers programmable and flexible features, such as sampling test on a wafer, ESD model, ESD pulse polarity, ESD pulse interval in a sequence, and automatic testing function.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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OLED Lifetime Test System
58131
The 58131 Lifetime Test System is designed specifically for the OLED industry. Model 58131 provides twoquadrant constant current (CC) and constant voltage (CV) stimulus to each OLED panel and acquires electrical and optical characteristics automatically. Two independent and isolated precision source-and-measure units (PMU) are incorporated in one modular card, which is capable of testing two OLED panels. Additional instrument cards are added to expand test capacity. Hot plug and play is a key feature of 58131. When a UUT fails or an instrument card needs to be replaced, 58131 does not have to be shutdown and testing continues for other UUTs. Hot plug and play obviates life test cycle restarts due to isolated faults and significantly improves life test efficiency. We firmly believe that hot plug and play capability should be mandatory for all lifetime test systems.
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VLSI Test Systems
50/100 MHz clock rate50/100 Mbps data rate1024 I/O pins (Max :1280 I/O pins)Up to 1024 sites Parallel testing32/64 M pattern memoryVarious VI sourceFlexible HW-architecture (Interchangeable I/O, VI, ADDA,)Real parallel trim/match functionTime & frequency measurement unit (TFMU)High-speed time measurement unit (HSTMU)AD/DA test optionSCAN test option (max 1G M/chain)ALPG test option for embedded memorySTDF tools supportTest program/pattern converter(J750, D10, V50, E320, SC312, V7, TRI-6020, ITS9K)User friendly windows 7 environmentCRAFT C/C++ programming languageSW (Software) same as 3380P & 3360P
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Test System Replication/Build-to-Print
Need to manufacture test stations? For more than 15 years we have sourced, assembled, tested and shipped fleets of robust, cost-effective solutions. We produce them at our high-volume facilities and deploy them around the world.
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Communications Test System for Frontline Diagnostics
ATS3000P
The ATS3000P is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000P also includes the sophisticated IF and baseband I/Q DigitalSignal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easyto-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets are available for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
