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3D
three dimensions.
- Kreon Technologies
product
ARMS
Is a 3D measuring arm, convenient in use whether for touch-probing or with the non-contact Kreon laser scanners.
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3D Scanner
HDI
The HDI 3D Scanner is a component-based system that offers the flexibility to tailor the scanner to your needs. Customize or upgrade the system exactly the way you want.
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3D Measurement Arm
FaroArm
The FARO Focus3D is a high-speed 3D laser scanner used for generating point clouds and capturing detailed 3D images for documentation purposes.
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3D RF Noise Measurment System
EMI-360
3D RF Noise Measurement System EMI-360 to realize the new EMC measurement.EMC measurement is possible to realize a low-cost and time reduction.
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3D Software
Along with manufacturing professional 3D scanners, Artec develops smart 3D scanning software. Meticulously designed to meet the needs of both new and experienced users alike, it is the best choice for any application.
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3D Sensors (Main Screen)
surfaceCONTROL
surfaceCONTROL sensors are used for 3D measurements and surface inspections. The sensors use the fringe projection principle to detect diffuse reflecting surface and to generate a 3D point cloud. This point cloud is subsequently evaluated in order to recognize geometry, extremely small defects and discontinuities on the surface. Sensors with different measurement areas are available. This enables the inspection of the finest of structures on components as well as shape deviations on large-area attachments. Powerful software packages are available for evaluation and parameter setting.
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Open eVision 3D Studio
Ease the configuration and the setup of a laser triangulation scanner using the Coaxlink Quad 3D-LLESimplify the calibration procedureDisplay interactive Depth Maps, 3D Point Clouds and ZmapsFree of charge
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Micro-CT for material science
Micro computed tomography is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It really represents 3D microscopy, where very fine scale internal structure of objects is imaged non-destructively. Bruker microtomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the sub-micron level.
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High-Resolution 3D Seismic Solution
PIKSEL
PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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High-speed 3D Solder Inspection Machine
YSi-SP
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Fast Particle Sizer Spectrometers
To measure rapidly-evolving aerosols (such as engine or 3D printer emissions), you need a particle sizer that can keep up. TSI has several fast particle sizer spectrometers that are designed for such situations. Whether your application requires 1 Hz (or faster) size distributions, a soot-specific data inversion, or sample dilution, TSI has a fast sizing solution.
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Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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Systems Tool Kit
STK
STK is a free 2D and 3D modeling environment used by engineers, mission analysts, operators and decision-makers from more than 700 global organizations to model complex systems (such as aircraft, satellites, ground vehicles and their sensors) to evaluate their performance in real or simulated time. Built on a time-dynamic, physics-based geometry engine, AGI software answers fundamental questions essential to solving dynamic analysis problems
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3D AOI Series
MV-6 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Optical Profilers
ZYGO's 3D Optical Profiler instruments enable precise, quantitative, ISO-compliant, non-contact surface measurement and characterization of micro- and nano-scale surface features, capturing up to two million data points in just seconds. Applications range from topography and waviness to roughness and microstructure characterization on samples as that vary from ultra-smooth sub-angstrom optical surfaces, to extremely rough and diffuse 3D printed surfaces.
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Open Source Computer Vision & Machine Learning Software Library
OpenCV
Open Source Computer Vision Library
The library has more than 2500 optimized algorithms, which includes a comprehensive set of both classic and state-of-the-art computer vision and machine learning algorithms. These algorithms can be used to detect and recognize faces, identify objects, classify human actions in videos, track camera movements, track moving objects, extract 3D models of objects, produce 3D point clouds from stereo cameras, stitch images together to produce a high resolution image of an entire scene, find similar images from an image database, remove red eyes from images taken using flash, follow eye movements, recognize scenery and establish markers to overlay it with augmented reality, etc.
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WAFERMAP
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Antenna
Our expertise in 3-D EM computation accelerates the antenna development through accurate simulations and performance optimizations with full CAD description of devices and precise definitions of materials.
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PDS Motion Scan
Allows a 3D Scanning sonar user to collect motion compensated 3D point clouds from a moving platformTeledyne PDS MotionScan system allows a 3D Scanning sonar user to collect motion compensated 3D point clouds from a moving platform. The MotionScan system is comprised of: an RTK capable dual antenna GPS with precision heading output, a heave, pitch and roll sensor, a topside control console. In combination with a BlueView 3D Multibeam Scanning Sonar this creates a full survey package.
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Sensors for Contour Measurement
Leuze electronic GmbH + Co. KG
The CMS 700i 3D contour measurement system detects the length, width, height, deformations and position of any objects as they pass by, independent of their shape and surface. Even polybags are reliably detected. The complete system includes all components for operation and installation under one part number. In contrast, light section sensors record a height profile along a projected laser line. This allows objects to be detected with high resolution in multiple dimensions. The integrated functions range from presence control to edge measurement and 3D object measurement.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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CAD Drafting Services In USA
CAD design service providers for architectural, electrical, mechanical, plumbing, and structural drafting jobs are available to support your CAD drawing requirements. We provide impressive 3D outputs in combination with 2D orthographic projections and detailed shop drawings to felicitate your pre-construction operations.
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Optical Coherence Tomography (OCT) systems
dOCTor™
dOCTor™ Optical Coherence Tomography (OCT) systemsoffer very high quality non-invasive tissue imaging in 2D and 3D. They are ideal for: In-Vivo Imaging Small Animal Imaging Tissue Engineering and Visualization Developmental BiologydOCTor systems are available in Swept-Source(SS) OCT and Time-Domain (TD) OCT configurations to satisfy different application imaging needs.
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Portable CMM Arm
Master3DGage®
Master3DGage® is a complete CMM hardware and software solution for inspection and reverse engineering. The multi-axis portable CMM features absolute encoders for quick start-up and highly accurate and precise measurements. Its lightweight, wireless design and battery-powered capability enable the Master3DGage® to be placed right into your CNC machine for in-process inspection.Optional 3D scanner and hot-swappable probes make it easy to switch from scanning complex profiles to probing primitive features in seconds.
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3D X-ray hybrid inspection system
YSi-X
Ideal for 100% inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target. X-ray, optical, infrared, and laser height measurement as standard equipment; hybrid and high reliability with multiple inspection modes.
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G3 System
Dragonfly
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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3D Imaging Sensor
The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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Surface Imaging & Metrology Software
Mountains®
Analyze multiple types of surface data. Turn your surface data into accurate, visual surface analysis reports. See every feature with high quality real-time 3D imaging of surface topography. Characterize surfaces in accordance with the latest metrology standards.
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3D Profilers
AEP Technology offers different kinds of 3D profilers. Rugged platform, advanced electronic equipment, clean test space, low carbon emission, low machine noise, high-end lens, etc., make our surface profiler unique in the imaging world. In addition to providing stand-alone contact 3D profilers and optical 3D profilers, we also provide the world's only cross-platform, dual-mode 3D profiler that is compatible with both tactile and optical profilometers.
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Profilometer
MicroCam™
MicroCam™ fiber-based optical non-contact 3D profilometers deliver: High-Speed Non-Contact Surface and Cross-Sectional Inspection 3D Online Measurements, GD&T and Imaging Long Stroke Profilometry with Sub-Micron Resolution Thickness, Roughness and Vibration Measurements Fiber-based Probes which reach into Bores, Tubes, and Crevices
