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- Applied Instruments, Inc.
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Signal Level Meter
XR-3W+
From satellite dish alignment, to UHF off-air antenna pointing, to cable TV MER measurements, the XR-3 is the meter for you! The XR-3 is the most capable meter offered by Applied Instruments. It's more durable than the popular Super Buddy meter, and has added features and performance. The XR-3's modular design with field swappable modules provides wide versatility to fit different measurement applications, including DBS satellite (i.e. Dish Network, DIRECTV, Bell TV, Shaw Direct), VSAT satellite (i.e. iDirect, Hughes Ku band, and more), VHF/UHF off-air (analog and ATSC digital), and CATV (QAM and analog). The XR-3 is great for installing and troubleshooting DISH SmartBox, Blonder Tongue, and other SMATV headend systems often used in hotels, multi-dwelling units, and institutional facilities. Modular Test Instrument. Satellite Finder. Installer Signal Meters. CATV Analyzer. Modules.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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High Voltage 50 Ω Pulse Generator
TLP-4010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Probe Card
VC20E Series
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Custom Assembly, Packaging and Qualification
DPACI specializes in providing Turn-Key Solutions. We offer comprehensive manufacturing, assembly, qualification, testing, and certification of high reliability EEE components. We have a dedicated, self-contained Class 10,000 clean room with Class 100 laminar flows certified to QML Q (Military) and V (Space) levels to perform all assembly operations from wafer processing to final hermetic package seal
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High Voltage 50 Ω Pulse Generator
TLP-3010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±8 kV*High pulse output current up to ±30 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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Single- and Dual-Yaw Axis Wafer Transport Robot
GPR-GB7SY
The GPR-GB7SY Yaw-Axis (single and dual yaw) robot features Genmark’s technologically advanced mechanisms including patented GPR and YAW technologies to achieve the highest level of performance currently available in an automated material handler capable of transporting up to 450mm wafer payloads with utmost reliability and precision.
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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AMIDA 5000 Tester
AMIDA 5000 is a high-end performance test system, combining analog, mixed-signal and logic with the latest test solutions. High pin count - as many as 512 smart multi-function pinframes and 128 sites. Ability to provide cost-optimized test solutions for a variety of consumer components in power management and mobile device components. This system has a higher number of parallel tests and a higher level of capability. This series of test systems provides a powerful test combination with high-speed hardware and software integration. The 5000 series test system is the best analog, mixed signal, digital IC, PA test system for engineering verification and mass production. It can be easily connected to all well-known wafer probing machines and sorters, and also supports parallel test functions. The 5000 series meets customers' needs for high-precision, high-resolution, high-reliability, user-friendly, and low-cost testing and measurement of test systems.
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Probing Solutions
ES62X-CMPS
The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
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Wafer Level Multi-Die Test System
ITC55WLMD
The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Sorters
Spartan™
The unified wafer management system gives the Spartan™ Sorter the minimum scale and complexity required to accomplish its core job – to move wafers as cleanly and as quickly as possible. The Spartan Sorter offers improved reliability and maximized efficiency, while delivering industry-leading cleanliness with the lowest particle levels.
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High Voltage 50 Ω Pulse Generator
TLP-12010A
High Power Pulse Instruments GmbH
- High pulse output current up to ±120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical 300 ps rise time- Wafer, package and system level TLP and HMM testing- 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 digital programmable pulse rise times out of: 300 ps to 50 ns (optional)- 1 built-in pulse width: 100 ns- Optional external pulse width extensions from 5 ns to 500 ns using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient software for system control and waveform data management- The software can control automatic probers for fast measurements of complete wafers- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface
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Wide Band Gap Production System
Reedholm has configured an integrated system, not just a set of boxes, for testing high power devices at the wafer level. Sophisticated testing, prober control, and database management do not carry a programming burden. As a result, fast, automated wafer testing is done in an inexpensive, compact probing platform.
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High Voltage 50 Ω Pulse Generator
TLP-8010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Combines TLP-8010A and TLP-4010C into one system*Can be operated together with TLP-8012A5 and TLP-3011C pulse width extenders*Ultra fast 50 Ω high voltage pulse output with typical rise time 100 ps (0-40 A) and 300 ps (> 40 A)*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω configuration*High pulse output current up to ±80 A (short circuit) with minimum 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns (0-40 A), 1 built-in pulse width: 100 ns (> 40 A)*The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0-40 A)*Optional external pulse width extensions from 5 ns to 500 ns (> 40…80 A) using the external pulse width extender TLP-8012A5*Built-in pulse reflection suppression*Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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Wafer/Chip/Package Semi-automated ESD Tester
400SW
Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Integrated Bonding Systems
EVG offers fully integrated and highly automated production systems for wafer bonding processes. A maximum level of automation and process integration opens the door to large-scale manufacturing and guarantees a proven transition of processes from R&D stage to production.
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High Power Devices
SemiProbe configures our PS4L Adaptive Architecture into the Voltarus (TM) family of probe stations to fulfill the unique requirements of testing high power devices at wafer level prior to packaging. Voltarus probe stations are available in manual, semiautomatic, and fully automatic configurations that can test and characterize power devices up to 10 KV or 200 Amps (pulsed).
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High Voltage 50 Ω Pulse Generator
TLP-8010A
High Power Pulse Instruments GmbH
*Wafer and package level TLP/HMM testing*Fast 50 Ω high voltage pulse output with typical 300 ps rise time*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω-configuration*High pulse output current up to ±80 A (short circuit) with 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 300 ps to 50 ns*1 built-in pulse width: 100 ns*Optional external pulse width extensions 5/10/50/100/200/500 ns using an external pulse width extender TLP-8012A5*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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Probe Card
VC43™/VC43EAF™
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
