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Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
- InterWorking Labs, Inc.
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SilverCreek SNMP Tests
Set up in less than five minutes - Windows or LinuxCustomize tests via Wizards, Script Generators, and moreAutomate operation with unambiguous test resultsIntegrate with other test harnesses and test toolsIncludes conformance, compliance, vulnerability, robustness, stress, and performance testingInvestigate failures and quickly resolve them with powerful diagnostic and analysis tools
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Cross-Section Analysis Laboratory
PCBs are constructed of a variety of materials such as glass, ceramic, copper, solder and Teflon. Trialon has the equipment and experienced staff to perform this difficult analysis. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Standard Electromagnetic Vibrator
KD-9363-EM
King Design Industrial Co., Ltd.
The purpose of vibration testing is to make a series of controllable vibration simulation in lab, no matter generated by natural or man-made vibration environment; such as waves, tidal flaps, wind, earthquake or rain and so on. It is to test if the product is capable of sustaining the vibration environment exerted from transporting or usage along its effective life cycle; and certify the standard of design & functional requirement of product. The value of vibration testing is to confirm the reliability of products and effectively screen out the bad products in factory; avoiding damages occurred at arrival; and to assess the failure analysis on the non-performing products; expecting to reach a high standard, high-reliability products. The vibration test stresses on the continuity and fatigue; and contributes to the understanding of product’s status under vibration circumstance in a normal environment; and avoids the product’s unpredictable damage caused under certain vibrating frequency for a long time.
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Regenerative Battery Pack Test System
17040
Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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Fiber TAPs
Profitap fiber TAPs provide secure in-line network access for the monitoring of 1–400 Gbps fiber networks. By splitting the light flowing on the network link, fiber TAPs deliver an exact copy of the data for real-time monitoring and analysis, without disrupting the network. Passive fiber optic TAPs require no power, and therefore introduce no point of failure when deployed in a network.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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Atomic Force Microscope
NX-Hivac
Park NX-Hivac allows failure analysis engineers to improve the sensitivity of their measurements through high vacuum Scanning Spreading Resistance Microscopy (SSRM). Because high vacuum scanning offers greater accuracy, better repeatability, and less tip and sample damage than ambient or dry N2 conditions, users can measure a wide range of dope concentration and signal response in failure analysis applications.
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Materials And Chemical Analysis
Anderson Materials Evaluation, Inc.
Materials characterization, failure analysis, quality control, and materials and process development services are offered. Our analytical techniques allow us to assess elemental and chemical material composition, thermal properties, coating thickness, electrochemical properties, surface chemistry, surface wetting, corrosion rates and pitting potentials, contamination and degradation problems, metallography, fractography, phase transitions, static coefficient of friction, adhesive bonding strength and causes of adhesive bonding failures, surface tension and surface energy, tensile and compressive strength, bend deflection, lapshear strength, elasticity properties, UV and visible light absorption and reflection, density and porosity, and many other material properties integral to improving your products.
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Battery Pack/Module Test Solution
Regenerative battery energy dischargeEnergy savingEnvironment protectionLow heat generateChannels paralleled for higher currentsCharge / discharge mode (CC, CV, CP) Constant current Constant voltage Constant powerDriving cycle simulationHigh precision measurement accuracyFast current conversionSmooth current without over shootTesting data analysis functionData recovery protection (after power failure)Independent protection of multi-channelBMS data recordingThermal chamber control integration
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Internal Vapor Analyzer
IVA® MODEL 210S
The IVA® system is specifically designed for the quantitative analysis of low molecular weight gases contained in hermetic packages, cavities and other enclosures. The Model 210s concept integrates automated hardware with easy-to-use icon-driven software. Its design permits routine quality control, failure analysis and research level testing operation as a turn-key analytical system. The IVA® Model 210s includes a high-performance, quadrupole-mass spectrometer analyzer, a sample-mounting interface and precision hardware. The instrument is also computer-controlled and equipped with exclusive ORS integrated system control software — which provides instrument control, data analysis, data archiving and ease of operation.
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Semi-automatic Measuring And Alignment System
McBain Z-NIR Near Infrared Inspection Microscope
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Acoustic Microscope
AMI D9650Z
The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.
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Damage Indication
FilterCHECK
Get the full picture immediately with FilterCHECK: accurate on-site damage indication — wherever you do maintenance.Equipment fluid filters have a story to tell. With FilterCHECK, filters reveal an accurate account of component wear and damage, plus a reliable prediction of the time remaining to component failure. Easy to use, field-deployable FilterCHECK automates filter debris analysis, so your team can manage maintenance decisions efficiently. Avoiding component failure, reducing maintenance costs and eliminating service interruptions: three reasons FilterCHECK belongs on the shop floor, wherever mission-critical equipment is serviced and maintained.
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ADLINK Software
The plug and play Edge IoT solution for machine condition monitoring enabling remote equipment monitoring, health scoring and predictive failure analysis to maximize overall equipment effectiveness (OEE).
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Automated DC Parametric Curve Tracer
MultiTrace
MultiTrace curve tracer is a mid-sized benchtop model supporting pin counts from 216-625 pins and includes the PGA-625 fixture as a standard interface. MultiTrace supports a wide range of test applications: Failure analysis, Reliability testing, Counterfeit device analysis, Nondestructive electrical counterfeit test, Opens, shorts leakage testing (OSL), Post decap electrical inspection, Optical fault localization, ESD testing, Latch-up testing, Supply current measurements, and more!
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Failure Analysis
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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IC Product Testing & Analysis Services
Integrated Service Technology
Integrated Service Technology Inc.
iST (Integrated Service Technology Inc.) is a leading lab-service company, specializing in the development of IC product testing & analysis, failure analysis, debugging, reliability test, material analysis. Apart from developing testing technologies for the upstream IC design and semiconductor industries, iST also expanded to provide a full-spectrum of services for the mid and downstream companies in the electronics industry.
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ISDD Tool Suite
eXpress provides an environment for the design, input, integration, assessment and optimisation of system diagnostics as well as Prognostic Health Management (PHM), system testability studies, failure modes and effects analysis and analysis of system dependability.
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FEA Software
Helius PFA
Helius PFA software provides powerful tools for enhanced FEA (finite element analysis) of composite structures, including progressive failure analysis.
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System Modeling for Diagnostic Design and Analysis
EXpress
eXpress is a comprehensive model-based diagnostics engineering software application providing an environment for the design, capture, integration, evaluation and optimization of complex or large-scale system diagnostics, prognostics health management (PHM), systems testability engineering, failure mode and effects analysis and system safety analysis. eXpress is uniquely suited to influence the diagnostic development for new designs or to exploit the diagnostic challenges of existing legacy systems. Its robust structure facilitates the capture of extensive interdisciplinary design knowledge providing an unmatched ability to corroborate, reuse and re-purpose expert knowledge in performing standardised testability, reliability and maintainability analyses.
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ISDD Tool Suite
The Integrated System Diagnostic Design or ISDD Tool Suite provides a start to finish solution for meeting all the diagnostic needs of system design. The ISDD design process is centered around functional modeling of systems which is used to develop the diagnostics and failure analysis necessary to fully support good system design. This includes: *Analysis of Fault Detection and Fault Isolation.*Analysis of critical failures and their impact upon safety.*Detecting and reducing false alarms caused by diagnostics.*The impact of prognostics upon fault detection/fault isolation and mitigation of critical failures.*Development of vehicle health management and troubleshooting diagnostics
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MPI Automated Probe Systems
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Material Analysis Laboratory
Trialon’s world class Material Analysis Laboratory consists of state-of-the-art equipment and experienced staff. Our specialty is to determine failure analysis of design, material, process and root cause in both current and future products across multiple industries.
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Plasma Profiling TOFMS
PP-TOFMS
Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Analytical Techniques
Anderson Materials Evaluation, Inc.
Our numerous analytical techniques, we tackle a wide range of materials challenges and commonly combines several analytical techniques to fully address complex and multi-dimensional materials issues. Our materials analysis laboratory provides XPS surface analysis, thermal analysis (TGA, DSC, TMA), FTIR infrared spectroscopy, UV-Vis spectrophotometry and reflectivity measurements, gas chromatography – mass spectroscopy (GC-MS), SEM/EDX, optical microscopy, mechanical testing, electrochemistry and corrosion analyses, residual gas mass spectroscopy, contact angle measurements, surface contamination measurements, adhesive bonding failure analysis, facility testing for silicone contamination, mechanical testing, metallography and fractography, density and porosity measurements, volatile organic component testing, friction, and other analytical capabilities. We continue to upgrade and expand our arsenal of analytical techniques and custom analytical methods to support our customers’ needs.
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Test System
ETS788XL
The 50/100 MHz ETS788XL system is the compact protable version of our ETS788. Made with the new high-performance precision components of our Griffin series, this portable powerhouse offers an optional tough road case and ready to go to any test site needed. Just pop off the covers and get started. Whether it's research, Failure Analysis, or single-event effects testing, his powerful member of the HiLevel family takes advantage of all of the tried and true features that have served users so successfully to date.
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Test System
ETS788
The 55/110 MHz ETS788 system boasts the same small footprint and cool quiet CMOS architecture as our ETS780 but with the new high-performance precision components of our Griffin series. This powerful member of the HiLevel family takes advantage of all of the tried and true features that have served users so successfully to date. Learn why the ETS788 is the perfect cost-effective solution for higher performance in Design Verification, Production and Failure Analysis.
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Real-time X-ray Inspection System
JewelBox 70T™
The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system’s 10-micron MicroTech™ x-ray source provides magnification from 7X to 2000X, with resolution of 100 line pairs/mm.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
