Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States
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product
Open-Frame Collet Socket with Solder Tail Pins
Series 518
Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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product
44-Pin 0.8mm QFP-to-44-Pin PLCC Adaptor
44-305263-20
44 Pin .8mm QFP to 44 Pin PLCC Adapter. cost effective means of upgrading to QFP without changing your PCB layout.
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product
SOIC and SOJ-to-DIP Adaptor
Series 45000X & 65000X
SOIC & SOJ to DIP Adapters. A cost effective means of upgrading to SOJ or SOIC...without changing your PCB layout.
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product
Thru-Hole 0.040 [1.02] Female DIP Strip
Series F40
Thru-Hole .040 [1.02] Female DIP Strips. This female DIP strip is used in conjunction with Aries Shorting Plug SP200, available separately, for your programming needs.
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product
Economy Model Vertisocket™
Series 800 and 822
Thrifty Model Vertisockets with Bifurcated Contacts. These low cost VertisocketsTM are recommended for high volume vertical display mounting applications. Very useful for connection of board-to-board jumpers and for DIP switches as well as LED devices.
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product
24-Pin SOIC w/Package-to-22-Pin 0.400" DIP
22-304504-18
24Pin SOIC w/ Package to 22 Pin .4 DIP. A cost effective means of upgrading to SOIC without changing your PCB layout.
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product
Vertisocket™ Horizontal Mounting
Series 800
Vertisockets Horizontal Mounting with Bifurcated Contacts. Aries offers a full line of VertisocketsTM for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting position and pin configuration provide exceptional design freedom.
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product
PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adaptor
Series 505
PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices.
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product
160-Position QFP-to-PGA Adapter
96-160M65
QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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product
DIP Header with Coined Contacts
Series 600
DIP Headers with Coined Contacts. Aries offers a full line of DIP headers, available with either coined or screw machine contacts. Consult Data Sheet No. 12035 for screw machine contacts. Snap-on, protective covers are available for all sizes shown below and accommodate .125 [3.18] to .750 [9.05] component heights. Consult Data Sheet No. 12033 for protective covers.
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product
Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
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product
DIP-to-JEDEC TO Adaptor Socket
1109522 & 1109523
DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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product
Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adaptor
1110748
Surface Mount to DIP Adapter for SOT-25, SOT-23A-6. Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. Longer male bottom pins are available at special request for easy use of probe clips. Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.
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product
QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adaptor
96-208M50
QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
