Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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product
Probing Machines
Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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product
Dicing Machines
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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For Grinder And Lathe
We offer an abundant lineup such as the PULCOM series for in-process and post-process measurements, and the SBS products for the grinding wheel’s automatic balance system.
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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product
Battery Jig
The Company provides battery evaluation jigs that realize "stable measurement", "equipment safety," "human safety," and "labor saving" in cycle tests and characteristic tests conducted when developing rechargeable batteries and capacitors.
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Non-contact Displacement Sensors
This is a flexible sensor that can be installed anywhere and is equipped with high environmental resistance enabling use in harsh environments.
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Auxiliary Equipment For Dicing Machines
We have a lineup of package singulation machines, automatic cleaning systems, chillers, etc. that support the dicing process.
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product
High Rigid Grinder
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
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product
CMP
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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Precision ACCRETECH Dicing Tools
Precision ACCRETECH Dicing Tools for precision cutting are derived from our unique development technology as well as our diverse application technology. We offer products that can cut a variety of materials, cover diverse cutting applications and satisfy today's requirement of "high quality & low cost".
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For Machining Center
We offer the ATC Run-Out Detection System and the Wireless Bore Gauge. We will boost the realization of increased productivity with high precision measurement technology.
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Optical Shaft Measuring System
The measurements and shape of the shaft or rotating partsare measured in an overwhelmingly short time. In our lineup, we can handle inspection and automation during production processes, so we can contribute to increased productivity at your company.
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product
Non-contact Surface Texture And Contour Measuring Instruments
From sub-nano level surface roughness to milli level profile with 3D.Tokyo Seimitsu provides non-contact type surface roughness and contour measuring instruments with the confidence born out of many years cultivating know-how of surface roughness measurements.
