Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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product
Optical Shaft Measuring System
The measurements and shape of the shaft or rotating partsare measured in an overwhelmingly short time. In our lineup, we can handle inspection and automation during production processes, so we can contribute to increased productivity at your company.
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product
Dedicated Measuring Machine
We offer measurement systems optimized for various production sites. We design and manufacture high precision, stable specialized measuring instruments to match requested specifications and requested performance.
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Non-contact Surface Texture And Contour Measuring Instruments
From sub-nano level surface roughness to milli level profile with 3D.Tokyo Seimitsu provides non-contact type surface roughness and contour measuring instruments with the confidence born out of many years cultivating know-how of surface roughness measurements.
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product
Precision ACCRETECH Dicing Tools
Precision ACCRETECH Dicing Tools for precision cutting are derived from our unique development technology as well as our diverse application technology. We offer products that can cut a variety of materials, cover diverse cutting applications and satisfy today's requirement of "high quality & low cost".
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X-ray CT System
The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
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Polish Grinders
The polish grinder is a single machine that can both slice various device wafers and remove damage,which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
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CMP
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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*Coordinate Measuring Machine
PRISMO ultra
PRISMO ultra uses uncompromising precision technology and was developed for measurements that require extremely high accuracy. PRISMO ultra incorporates a well-balanced combination of cutting-edge accuracy, speed, rigidity, and cost performance. This 3D coordinate measuring machine is best suited for research and development of high-precision parts and calibration inspection of reference gages.
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Air Micrometers
As the pioneer of air micrometers and electric micrometers in Japan, we respond to a variety of needs for high precision production line measurements.
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product
High Rigid Grinder
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
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Roundness And Cylindrical Profile Measuring Instruments
We respond to a variety of needs with our lineup including both rotating table types that enable high precision measurement of cylindrical workpieces, and rotating type detectors that handle eccentric or heavy workpieces.
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For Grinder And Lathe
We offer an abundant lineup such as the PULCOM series for in-process and post-process measurements, and the SBS products for the grinding wheel’s automatic balance system.
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product
Laser Interferometers
Measurements of the length displacement or yawing and pitching, measurements of rotation angles, measurements of overshoots during vibrations or when stopped and of uneven speed, etc. can be handled. Length measuring instruments can be used for a variety of purposes, including precise inspection of heavy duty equipment.
