Smiths Interconnect

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WLCSP Probe Heads

Smiths Interconnect

Smiths Interconnect

Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.

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Connectors

Smiths Interconnect

Smiths Interconnect

Through our Hypertac, IDI and Sabritec technology brands, we supply application-specific, high-reliability electrical interconnect solutions from highly integrated assemblies to microminiature connectors and spring probe contacts. The core of our advanced interconnect solutions is our contact technologies: Hyperboloid, Tortac, Spring Probe, High Speed, Edge Card, Fiber Optic, EMI/EMP, High Power and High Temperature.

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Isolators & Circulators

Smiths Interconnect

Smiths Interconnect

Smiths Interconnect's Isolators and Circulators set the industry benchmark for low loss and high power performance in the most stringent Military and Space environments.

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Active Components

Smiths Interconnect

Smiths Interconnect

MUD frequency doublers featuring Millitech technology are balanced resistive-mode multipliers covering full waveguide bands. Power flatness for a given input power level for these units is typically ± 2.0 dB across the band.

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Robust Modular Rectangular Connectors

B Series

Smiths Interconnect

B Series - Smiths Interconnect

Smiths Interconnect addresses the industry’s need for reliable, low cost interconnections with the rectangular modular connectors B Series. B Series incorporates the highly reliability Hypertac® hyperboloid contact which provides optimum performance in harsh conditions such as extreme mechanical shock and high mating cycles.

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Semiconductor Test

Smiths Interconnect

Smiths Interconnect

Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.

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Cable Assemblies & Harnesses

Smiths Interconnect

Smiths Interconnect

High performance microwave cable assemblies and coaxial components supporting critical operations with application specific premium interconnects for high durability. Embedded with RF Florida Lab technology, our cables are available with customised option packages and are especially well-suited for precision testing applications and harsh environments in aircraft, marine, space and ground applications.

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Miniature Snap Fit Connectors

SnapTac® Series

Smiths Interconnect

SnapTac® Series - Smiths Interconnect

Smiths Interconnect's SnapTac® Seriess is a lightweight, robust, quick release miniature connector, featuring IP67 sealing and EMI shielding. The series is available in both circular (7, 13, 19 ways) and rectangular (12, 21, 30 ways) styles. They are equipped with Hyperspring contacts, designed to protect the electrical interface against extreme environmental conditions.

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Test Sockets

Smiths Interconnect

Smiths Interconnect

Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.

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Hyperboloid Contacts

Smiths Interconnect

Smiths Interconnect

Hypertac® hyperboloid is the original superior performing contact technology for use in demanding environments where reliability and safety are critical. The shape of the contact sleeve is formed by hyperbolically arranged contact wires, which align themselves elastically as contact lines around the pin, providing a number of linear contact paths. The smallest practical pin diameter is 0.3mm but there is effectively no upper limit.

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Embedded Transceivers

Smiths Interconnect

Smiths Interconnect

Embedded transceivers are chip-sized components based on 850 nm VCSELs and offer bandwidth up to 300 Gbps for short reach applications (<300 m). These transceivers can be soldered or socketed to a printed circuit board and are well suited for small, compact systems requiring high I/O density, low power, and small space. Many of these transceivers have been qualified to operate in harsh environments, such as the ones found in space, and aerospace and defense applications.

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High Power Rack And Panel Connectors

LSH Series

Smiths Interconnect

LSH Series - Smiths Interconnect

The LSH rack and panel connectors include leading-edge Hypertac® hyperboloid technology. The Polyphenylene sulfide (PPS) insulators interconnect technology ensures LSH connectors are easy mating. The LSH Series delivers customers a high life cycle.

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Backplane Connectors

Smiths Interconnect

Smiths Interconnect

Offering a broad portfolio of backplane connectors that include SOSA aligned optical, COTS plus hard metric, VITA standard and high speed twinax interconnects. Our interconnect solutions address the requirements of mission-critical applications within commercial aerospace, space and defense market segments.

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Ka-Band Antenna Systems

Smiths Interconnect

Smiths Interconnect

The KaStream 5000® MK II is specifically designed to provide maximum network flexibility and allow end-users to define the modem to meet their operational needs.

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Backplane Twinax Connectors

Smiths Interconnect

Smiths Interconnect

We have taken the standard housing configuration of the P1 & P3 mounting dimensions while incorporating true differential pair contacts within the P1 & P3 dimensional constraints. P1 connector housing contains 21 position true differential pair blind mate contacts allowing board designers to carry high density differential pair signals from the LRU via motherboard to daughter-card plug in  modules with a single connector P1 type housing.